IQ-BOND 2175
IQ-BOND 2175 | |
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Product group | Underfill encapsulants |
Strong points | Very low viscosity, for very small bondlines < 5 µm |
One Komponent or two komponents | 1 K |
Color | Clear |
Viscosity | low |
Cure | Fast @ Low temperature |
CTE | |
Tg | |
Shore Hardness | |
Thermal conductivity | |
Work life | |
Storage | 12 months @ -40°C |
Fineness (µm) | |
Density (gr/cc) | |
Thyxotropie | Low |
Datasheet |
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