IQ-BOND 2175



IQ-BOND 2175
Product group Underfill encapsulants
Strong points Very low viscosity, for very small bondlines < 5 µm
One Komponent or two komponents 1 K
Color Clear
Viscosity low
Cure Fast @ Low temperature
CTE
Tg
Shore Hardness
Thermal conductivity
Work life
Storage 12 months @ -40°C
Fineness (µm)
Density (gr/cc)
Thyxotropie Low
Datasheet