IQ-BOND 5970-ACE
IQ-BOND 5970-ACE | |
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Product group | Electrically conductive adhesive (Anisotropic) |
Strong points | Fast-cure, heat-curing adhesive for Flip Chip Attach, thermode-curing process, high curing speeds |
One Komponent or two komponents | 1 K |
Color | Brown |
Viscosity | Low |
Cure | Fast @ High temperature |
CTE | |
Tg | |
Shore Hardness | |
Thermal conductivity | |
Work life | |
Storage | 3 months @ -20°C; 6 months @ -40°C |
Fineness (µm) | |
Density (gr/cc) | |
Thyxotropie | Medium |
Datasheet |
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