IQ-BOND 5970-ACE



IQ-BOND 5970-ACE
Product group Electrically conductive adhesive (Anisotropic)
Strong points Fast-cure, heat-curing adhesive for Flip Chip Attach, thermode-curing process, high curing speeds
One Komponent or two komponents 1 K
Color Brown
Viscosity Low
Cure Fast @ High temperature
CTE
Tg
Shore Hardness
Thermal conductivity
Work life
Storage 3 months @ -20°C; 6 months @ -40°C
Fineness (µm)
Density (gr/cc)
Thyxotropie Medium
Datasheet