Adesivi Termo-conduttivi
Electronic devices which get smaller, lighter, and always better in performance. This trend towards electronics miniaturization has been and always will be one of the driving forces for improved thermal dissipation materials.
Roartis® has developed a range of 1-component, as well as 2-component thermally conductive materials, which help in dissipating the heat. All of the electrically conductive materials, based on Ag-metal fillers, have thermal conductivity >5W/m.°K.
The list of products below are insulating materials, combined with very small thermally conductive fillers, ideal for those applications where the heat must be dissipated away from temperature sensitive components, by means of very thin bondlines.
Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
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https://www.iq-bond.com/products/iq-bond-2650-t-fl/ compare |
IQ-BOND 2650-T-FL | Thermally conductive gapfiller | High Viscosity, non sagging, fast cure, flexible | 2K | Light Red | High | 12 months @ RT |
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https://www.iq-bond.com/products/iq-bond-2647-t-fl/ compare |
IQ-BOND 2647-T-FL | Thermally Conductive | solvent-free, two-component, thermally conductive, epoxy based adhesive, developed for “low stress applications” | 2 K (1:1 wght%) | Dark orange / Red | High | Medium @ Low temperature | 0.8 | Low |
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https://www.iq-bond.com/products/iq-bond-2649-t-fl/ compare |
IQ-BOND 2649-T-FL | Thermally conductive | High viscosity, Non-Sagging, Very Flexible, 2-komponent | 2 K (1:1 wght%) | Dark orange / Red | Very High | Medium @ Low temperature | 1.3 | 12 months @ RT | High |
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https://www.iq-bond.com/products/iq-bond-2648-t-fl/ compare |
IQ-BOND 2648-T-FL | Thermally conductive | very flexible, solvent-free, two-component, thermally conductive, epoxy based adhesive and/or gapfiller, developed for “low stress applications” | 2 K | Dark orange / Red | Medium | Medium @ Low temperature | 1.1 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-cast-9850-t-ab/ compare |
IQ-CAST 9850-T-AB | Thermally Conductive | Thermal shock resistant, low CTE, room temperature curable, electrically insulating, thermally conductive | 2 K (mix-ratio 100:3,5) | Black | High | Medium @ Low temperature | 1,3 | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9044-t-ab/ compare |
IQ-CAST 9044-T-AB | Thermally conductive | High thermally conductive, Room temperature cure | 2 K (1:1 wght%) | Black | High | Medium @ Low temperature | 1,8 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-cast-9025-t-ab/ compare |
IQ-CAST 9025-T-AB | Thermally Conductive | Economic, thermally conductive adhesive, for applications which require heat dissipation | 2 K (1:1 wght%) | Black | Low | Medium @ Low temperature | 1,1 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-cast-9024-t-ab/ compare |
IQ-CAST 9024-T-AB | Thermally Conductive | Encapsulation of electronic and/or industrial components which require heat dissipation, very well suited for high temperature applications, requiring continuous protection up to 150°C | 2 K (1:1 wght%) | Black | Low | Medium @ Low temperature | 1,1 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2801-t/ compare |
IQ-BOND 2801-T | Thermally conductive | Non-flow/non-sagging, higher viscosity/higher thyxo version of IQ-BOND 2800-T | 1 K | White | Very High | Other | 1,2 | 1 month - 5°C; 6 months - -20°C; 12 months - -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2800-t/ compare |
IQ-BOND 2800-T | Thermally conductive | Optimized for dispensing, long potlife, fine filler for thin bondline | 1 K | White | High | Other | 1 | 1 month - 5°C; 6 months - -20°C; 12 months - -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2612-t-fc/ compare |
IQ-BOND 2612-T-FC | Thermally Conductive | Fast cure, thermo-couple bonding, faster version of IQ-BOND 2611-T-FC | 2 K (1:1 wght%) | White | Medium | Fast @ Low temperature | 1,3 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2611-t-fc/ compare |
IQ-BOND 2611-T-FC | Thermally conductive | Fast cure, thermo-couple bonding | 2 K (1:1 wght%) | White | Medium | Fast @ Low temperature | 1,2 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2610-t-ab/ compare |
IQ-BOND 2610-T-AB | Thermally Conductive | Room-temperature curable, non-sagging, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C) | 2 K (mix-ratio 100:39) | Black | Very High | Fast @ Low Temperature | 1,3 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2609-t-ab/ compare |
IQ-BOND 2609-T-AB | Thermally Conductive | Very fast curable, non-sagging, high viscosity, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C) | 2 K (4:1 wght%) | Black | Very High | Fast @ Low temperature | 0,9 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2432-lv-t/ compare |
IQ-BOND 2432-LV-T | Thermally conductive | Flexible dielectric, thermally conductive, non-abrasive filler, high adhesion strength, lower viscous version of IQ-BOND 2432- | 1 K | White | Medium | Other | 0,9 | 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-24-32-t/ compare |
IQ-BOND 2432-T | Thermally Conductive | Dispensing, printing, stamping processes, high adhesion strength, based on very fine non-abrasive filler technology | 1 K | White | 50.000 mPa.s | 15 min @ 175°C / 60 min @ 150°C / 90 min @ 120°C | 0,9 | 12 hrs | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2238-t/ compare |
IQ-BOND 2238-T | Thermally conductive | Low temperature cure adhesive, long potlife, very fast curing cycles, medium viscosity | 1 K | White | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,7 - 0,8 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2236-t/ compare |
IQ-BOND 2236-T | Thermally conductive | Low temperature adhesive, long potlife, very fast curing cycles | 1 K | White | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,6-0,7 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2235-t/ compare |
IQ-BOND 2235-T | Thermally conductive | Non-sagging-adhesive | 1 K | White | Very High | Fast @ High temperature; Medium @ Medium temperature | 1,1 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2234-t/ compare |
IQ-BOND 2234-T | Thermally conductive | Optimized for small dot dispensing, very fast curing cycles | 1 K | Milky | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,9 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2232-t/ compare |
IQ- BOND 2232-T | Thermally conductive | Optimized for small dot dispensing, very fast curing cycles | 1 K | White | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,9 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2231-t/ compare |
IQ-BOND 2132-T | Thermally conductive | Economic, thermally conductive adhesive with a long potlife | 1 K | White | Low | Fast @ High temperature; Medium @ Medium temperature | 0,6-0,7 | 2 months - 5°C; 6 months - -20°C; 12 months - -40° | Medium |
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https://www.iq-bond.com/products/iq-bond-1632-t/ compare |
IQ-BOND 1632-T | Thermally conductive | Easy mix-ratio 1:1; flexible for CTE mismatch; high temperature resistance (200°C) | 2 K (1:1 wght%) | grey | High | Medium @ High temperature | 1,1-1,2 | 12 months @ 25°C | Medium |
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https://www.iq-bond.com/products/wcx/ compare |
IQ- BOND 1501-T | Thermally conductive | Alumina-filled, economic, long potlife (>1 week) | 1 K | White | Medium | Medium @ Medium temperature | 0.8-0.9 | 1 month - 5°C; 6 months - -20°C; 12 months - -40°C | Medium |
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