Die Attach Adhesives
Within ROARTIS®’ range of electrically and insulating adhesives, various products have a rheology optimized for die attach application. Our electrically conductive and insulating adhesives are optimized for high speed dispensing or jetting.
| Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
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https://www.iq-bond.com/products/iq-bond-2722/ compare |
IQ-BOND 2722 | Insulating | Fast cure, dispensing or jetting processes, Low temperature die attach for flex substrates | Bright Yellow | 100.000 mPa.s | 60 min @ 80°C | 5 days | ||||||||||
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https://www.iq-bond.com/products/iq-bond-2705/ compare |
IQ-BOND 2705 | Insulating | Fast cure, dispensing or jetting processes, thermode or conveyor belt oven, fastest version based on hybrid epoxy chemistry | Beige | 35.000 mPa.s | 1 min @ 150°C / 5 sec @ 170°C | 2 days | ||||||||||
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https://www.iq-bond.com/products/iq-bond-2700/ compare |
IQ-BOND 2700 | Insulating | Fast cure, dispensing or jetting processes, thermode or conveyor belt oven | Milky/clear | 10.000 mPa.s | 5 min @ 120°C / 10 sec @ 170°C | 5 days |
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https://www.iq-bond.com/products/iq-bond-2487/ compare |
IQ-BOND 2487 | High temperature resistant | Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive | 1 K | Milky - Beige | 18.000 mPa.s | Multiple stage cure: 2hrs @ 90°C + 3hrs @ 150°C | 230° C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-5481-ce/ compare |
IQ-BOND 5481-CE | Electrically conductive adhesive (Isotropic) | For high temperature applications | 1 K | Silver | 15.000 mPa.s | Multiple stage cure: 2 hrs @ 90°C + 3 hrs @ 150°C | 230°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-5404-hv-ce/ compare |
IQ-BOND 5404-HV-CE | Electrically conductive adhesive (Isotropic) | Dispensing and jetting through very fine needles, low temperature, higher viscosity version of IQ-BOND 5404-CE | 1 K | Silver | 140.000 mPa.s | 60 min @ 150°C / 120 min @ 120°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-5404-ce/ compare |
IQ-BOND 5404-CE | Electrically conductive adhesive (Isotropic) | Dispensing and jetting through very fine needles, low temperature | 1 K | Silver | 35.000 mPa.s | 60 min @ 150°C / 120 min @ 120°C | 48 hrs | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5402-ce/ compare |
IQ-BOND 5402-CE | Electrically conductive adhesive (Isotropic) | Short curing cycles, good electrical conductivity, high speed small dot dispensing, lower viscosity version of IQ-BOND 5402-CE | 1 K | Silver | 78.000 mPa.s | 5 min @ 150°C / 15 min @ 120°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5132-ce/ compare |
IQ-BOND 5132-CE | Electrically conductive adhesive (Isotropic) | Flexible, dispensing/printing/stamping, electrically conductive version of IQ-BOND 2132 | 1 K | Silver | 15.000 mPa.s | 15 min @ 175°C / 90 min @ 120°C | 12 hrs | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-24-32-t/ compare |
IQ-BOND 2432-T | Thermally Conductive | Dispensing, printing, stamping processes, high adhesion strength, based on very fine non-abrasive filler technology | 1 K | White | 50.000 mPa.s | 15 min @ 175°C / 60 min @ 150°C / 90 min @ 120°C | 0,9 | 12 hrs | 6 months @ -20°C; 12 months @ -40°C | High |
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