Wärmeleitkleber

Elektronische Geräte werden immer kleiner, leichter und leistungsfähiger. Dieser Trend der elektronischen Miniaturisierung ist eine der treibenden Kräfte für verbesserte wärmeableitende Materialien.

Roartis® hat ein Portfolio von 1-Komponent- und 2-Komponenten-Wärmeleitmaterialien entwickelt, die helfen die Wärme abzuleiten. Alle elektrisch leitfähigen Materialien, basierend auf Ag-Metall-Füllstoffen, haben eine Wärmeleitung von > 5 W/m.°K.

Die folgenden Produkte sind isolierende Materialien, oft kombiniert mit sehr kleinen wärmeleitfähigen Füllstoffen, ideal für Anwendungen, bei denen Wärme durch dünne Verbindungslinien entfernt werden muss.

1 of 2 Components

Viscosity

Thyxotropie

Cure

Color

Product	Product group	Strong points	One komponent or two komponents	Color	Viscosity	Cure	Thermal conductivity	Work life	Storage	Thyxotropie
IQ-BOND 2650-T-FL	Thermally conductive gapfiller	High Viscosity, non sagging, fast cure, flexible	2K	Light Red	High				12 months @ RT
IQ-BOND 2647-T-FL	Thermally Conductive	solvent-free, two-component, thermally conductive, epoxy based adhesive, developed for “low stress applications”	2 K (1:1 wght%)	Dark orange / Red	High	Medium @ Low temperature	0.8			Low
IQ-BOND 2649-T-FL	Thermally conductive	High viscosity, Non-Sagging, Very Flexible, 2-komponent	2 K (1:1 wght%)	Dark orange / Red	Very High	Medium @ Low temperature	1.3		12 months @ RT	High
IQ-BOND 2648-T-FL	Thermally conductive	very flexible, solvent-free, two-component, thermally conductive, epoxy based adhesive and/or gapfiller, developed for “low stress applications”	2 K	Dark orange / Red	Medium	Medium @ Low temperature	1.1		12 months @ RT	Medium
IQ-CAST 9850-T-AB	Thermally Conductive	Thermal shock resistant, low CTE, room temperature curable, electrically insulating, thermally conductive	2 K (mix-ratio 100:3,5)	Black	High	Medium @ Low temperature	1,3		12 months @ RT	Low
IQ-CAST 9044-T-AB	Thermally conductive	High thermally conductive, Room temperature cure	2 K (1:1 wght%)	Black	High	Medium @ Low temperature	1,8		12 months @ RT	Medium
IQ-CAST 9025-T-AB	Thermally Conductive	Economic, thermally conductive adhesive, for applications which require heat dissipation	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature	1,1		12 months @ RT	Medium
IQ-CAST 9024-T-AB	Thermally Conductive	Encapsulation of electronic and/or industrial components which require heat dissipation, very well suited for high temperature applications, requiring continuous protection up to 150°C	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature	1,1		12 months @ RT	Medium
IQ-BOND 2801-T	Thermally conductive	Non-flow/non-sagging, higher viscosity/higher thyxo version of IQ-BOND 2800-T	1 K	White	Very High	Other	1,2		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	High
IQ-BOND 2800-T	Thermally conductive	Optimized for dispensing, long potlife, fine filler for thin bondline	1 K	White	High	Other	1		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	High
IQ-BOND 2612-T-FC	Thermally Conductive	Fast cure, thermo-couple bonding, faster version of IQ-BOND 2611-T-FC	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature	1,3		12 months @ RT	Medium
IQ-BOND 2611-T-FC	Thermally conductive	Fast cure, thermo-couple bonding	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature	1,2		12 months @ RT	Medium
IQ-BOND 2610-T-AB	Thermally Conductive	Room-temperature curable, non-sagging, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C)	2 K (mix-ratio 100:39)	Black	Very High	Fast @ Low Temperature	1,3		12 months @ RT	Medium
IQ-BOND 2609-T-AB	Thermally Conductive	Very fast curable, non-sagging, high viscosity, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C)	2 K (4:1 wght%)	Black	Very High	Fast @ Low temperature	0,9		12 months @ RT	Medium
IQ-BOND 2432-LV-T	Thermally conductive	Flexible dielectric, thermally conductive, non-abrasive filler, high adhesion strength, lower viscous version of IQ-BOND 2432-	1 K	White	Medium	Other	0,9		6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2432-T	Thermally Conductive	Dispensing, printing, stamping processes, high adhesion strength, based on very fine non-abrasive filler technology	1 K	White	50.000 mPa.s	15 min @ 175°C / 60 min @ 150°C / 90 min @ 120°C	0,9	12 hrs	6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2238-T	Thermally conductive	Low temperature cure adhesive, long potlife, very fast curing cycles, medium viscosity	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature	0,7 - 0,8		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2236-T	Thermally conductive	Low temperature adhesive, long potlife, very fast curing cycles	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature	0,6-0,7		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2235-T	Thermally conductive	Non-sagging-adhesive	1 K	White	Very High	Fast @ High temperature; Medium @ Medium temperature	1,1		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2234-T	Thermally conductive	Optimized for small dot dispensing, very fast curing cycles	1 K	Milky	Medium	Fast @ High temperature; Medium @ Medium temperature	0,9		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ- BOND 2232-T	Thermally conductive	Optimized for small dot dispensing, very fast curing cycles	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature	0,9		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2132-T	Thermally conductive	Economic, thermally conductive adhesive with a long potlife	1 K	White	Low	Fast @ High temperature; Medium @ Medium temperature	0,6-0,7		2 months - 5°C; 6 months - -20°C; 12 months - -40°	Medium
IQ-BOND 1632-T	Thermally conductive	Easy mix-ratio 1:1; flexible for CTE mismatch; high temperature resistance (200°C)	2 K (1:1 wght%)	grey	High	Medium @ High temperature	1,1-1,2		12 months @ 25°C	Medium
IQ- BOND 1501-T	Thermally conductive	Alumina-filled, economic, long potlife (>1 week)	1 K	White	Medium	Medium @ Medium temperature	0.8-0.9		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	Medium

Wärmeleitkleber

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