Resistente alle alte temperature
Adesivi microelettronici, a base di chimica epossiibrida modificata, con una Tg (temperatura di trasmissione del vetro) di 250°C, che li rende adatti come alternativa ai materiali poliimmide e/o nonilfenolo contenenti poliimmide e/o estere cianato attualmente ampiamente utilizzati.
| Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
https://www.iq-bond.com/products/iq-bond-2580/ compare |
IQ-BOND 2580 | High Temperature Resistant | High tg, dam adhesive, high reliability | 1K | Black | High | High | 6 months @ -40°C |
| ||||||||
|
https://www.iq-bond.com/products/iq-coat-6000/ compare |
IQ-COAT 6000 | High temperature resistant | Solvent based, high temperature resistant coating for industrial and electronic applications | 1 K | Transparant | Low | 12 months @ RT |
| |||||||||
|
https://www.iq-bond.com/products/iq-bond-2487/ compare |
IQ-BOND 2487 | High temperature resistant | Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive | 1 K | Milky - Beige | 18.000 mPa.s | Multiple stage cure: 2hrs @ 90°C + 3hrs @ 150°C | 230° C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C |
| ||||||
|
https://www.iq-bond.com/products/iq-bond-5481-ce/ compare |
IQ-BOND 5481-CE | Electrically conductive adhesive (Isotropic) | For high temperature applications | 1 K | Silver | 15.000 mPa.s | Multiple stage cure: 2 hrs @ 90°C + 3 hrs @ 150°C | 230°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C |
| ||||||
|
https://www.iq-bond.com/products/iq-bond-2481/ compare |
IQ-BOND 2481 | Underfill encapsulants | high reliability, thermal cycling from -65°C up to 200°C possible | 1 K | Black | Medium | 3 months @ -20°C; 6 months @ -40°C | Medium |
| ||||||||
|
https://www.iq-bond.com/products/iq-bond-2178/ compare |
IQ-BOND 2178 | Underfill encapsulants | resists temperatures over 200°C | 1 K | Milky - Beige | Medium | 6 months @ -40°C | Low |
| ||||||||
|
https://www.iq-bond.com/products/iq-bond-2520/ compare |
IQ-BOND 2520 | Glob Top encapsulant | High Tg (~250°C), for high reliability, high temperature applications | 1 K | Black | High | 6 months @ -40°C |
|
