Materiali di sinterizzazione

Adesivi termoindurenti a base epossidica a sinterizzazione ibrida o pasta sinterizzante a base di argento per applicazioni di fissaggio dello stampo ad alta potenza. Offre la combinazione di resistenza alle alte temperature, combinata con la migliore conduttività termica ed elettrica della categoria. Le applicazioni tipiche includono semiconduttori di potenza, LED ad alta luminosità, moduli di potenza per veicoli elettrici, dispositivi RF, diodi laser, sostituzione di saldature, celle solari concentrate, ecc.

Nonostante l’elevato carico di riempitivo, questi materiali hanno una viscosità relativamente bassa. Pertanto, la reologia è ideale per l’erogazione e lo stampaggio di piccoli punti.

Attualmente i nostri materiali di sinterizzazione sono a base di argento ma stiamo lavorando su altre tecnologie, contattateci per ulteriori informazioni.

1 of 2 Components

Viscosity

Thyxotropie

Cure

Color

Product	Product group	Strong points	One komponent or two komponents	Color	Viscosity	Cure	Tg	Thermal conductivity	Work life	Storage	Thyxotropie
IQ-BOND 8429-BLUE UV	Dielectric Ink	UV Acrylate / Bridging coating in printed electronics (RFID antenna’s)		Green	30.000 mPa.s					12 months
IQ-BOND 8429-BLUE UV	Dielectric Ink	UV Acrylate / Bridging coating in printed electronics (RFID antenna’s)		Blue	28.000 mPa.s					12 months
IQ-INQ 1202	Electrically Conductive Ink	Standard for Screen printing, Economical		Gray	21.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1201	Electrically Conductive Ink	Standard for Screen printing, Economical		Light Brown	20.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1100	Electrically Conductive Ink	Standard for Screen printing		Black	36.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1002	Electrically Conductive Ink	Excellent Elongation		Silver	15.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1000	Electrically Conductive Ink	Standard for Screen printing, Economical		Silver	15.000 mPa.s	15 min @ 120°C				12 months
IQ-SINTER 5461	Sinter paste	High thermally & electrically conductive (> 200 W/m.K , 5 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering		Silver	160.000 mPa.s	Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C			12 hrs
IQ-SINTER 5460	Sinter paste	High thermally & electrically conductive (> 200 W/m.K , 4 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering		Silver	53.000 mPa.s	Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C			24 hrs
IQ-BOND 5451-HSCE	Hybrid sinter paste	High speed, fine dot dispensing Higher viscosity & improved electrically conductivity version of IQ-BOND 5450-HSCE (> 60 W/m.K , 3,8 x 10-6 Ohm.cm)		Silver	45.000 mPa.s	Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C			12 hrs
IQ-BOND 5450-HSCE	Hybrid sinter paste	High speed, fine dot dispensing High thermally & electrically conductivity (> 60 W/m.K , 9 x 10-6 Ohm.cm)		Silver	20.000 mPa.s	Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C			12 hrs
IQ-BOND 2722	Insulating	Fast cure, dispensing or jetting processes, Low temperature die attach for flex substrates		Bright Yellow	100.000 mPa.s	60 min @ 80°C			5 days
IQ-BOND 2705	Insulating	Fast cure, dispensing or jetting processes, thermode or conveyor belt oven, fastest version based on hybrid epoxy chemistry		Beige	35.000 mPa.s	1 min @ 150°C / 5 sec @ 170°C			2 days
IQ-BOND 2700	Insulating	Fast cure, dispensing or jetting processes, thermode or conveyor belt oven		Milky/clear	10.000 mPa.s	5 min @ 120°C / 10 sec @ 170°C			5 days
IQ-BOND 2580	High Temperature Resistant	High tg, dam adhesive, high reliability	1K	Black	High		High			6 months @ -40°C
IQ-BOND 2650-T-FL	Thermally conductive gapfiller	High Viscosity, non sagging, fast cure, flexible	2K	Light Red	High					12 months @ RT
IQ-COAT 6000	High temperature resistant	Solvent based, high temperature resistant coating for industrial and electronic applications	1 K	Transparant	Low					12 months @ RT
IQ-BOND 2487	High temperature resistant	Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive	1 K	Milky - Beige	18.000 mPa.s	Multiple stage cure: 2hrs @ 90°C + 3hrs @ 150°C	230° C		24 hrs	3 months @ -20°C; 6 months @ -40°C
IQ-BOND 5481-CE	Electrically conductive adhesive (Isotropic)	For high temperature applications	1 K	Silver	15.000 mPa.s	Multiple stage cure: 2 hrs @ 90°C + 3 hrs @ 150°C	230°C		24 hrs	3 months @ -20°C; 6 months @ -40°C
IQ-BOND 2481	Underfill encapsulants	high reliability, thermal cycling from -65°C up to 200°C possible	1 K	Black	Medium					3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2178	Underfill encapsulants	resists temperatures over 200°C	1 K	Milky - Beige	Medium					6 months @ -40°C	Low
IQ-BOND 2520	Glob Top encapsulant	High Tg (~250°C), for high reliability, high temperature applications	1 K	Black	High					6 months @ -40°C
IQ-BOND 2647-T-FL	Thermally Conductive	solvent-free, two-component, thermally conductive, epoxy based adhesive, developed for “low stress applications”	2 K (1:1 wght%)	Dark orange / Red	High	Medium @ Low temperature		0.8			Low
IQ-BOND 2649-T-FL	Thermally conductive	High viscosity, Non-Sagging, Very Flexible, 2-komponent	2 K (1:1 wght%)	Dark orange / Red	Very High	Medium @ Low temperature		1.3		12 months @ RT	High
IQ-BOND 2648-T-FL	Thermally conductive	very flexible, solvent-free, two-component, thermally conductive, epoxy based adhesive and/or gapfiller, developed for “low stress applications”	2 K	Dark orange / Red	Medium	Medium @ Low temperature		1.1		12 months @ RT	Medium
IQ-BOND 8424 UV	UV-Acrylate	UV-curable, flexibilized, one component, acrylic-based adhesive or coating for optical applications	1 K	Clear	Low	Fast @ Low Temperature				12 months @ 5-8°C	Low
IQ-BOND 7292 UV	UV-Acrylate, Glob Top	One component, medium viscosity, medium thixotropy, epoxy-based, UV-curable GLOB-TOP adhesive	1 K	White	Medium	~30 seconds at 120 mW/cm² for a 500 μm thick layer (UV-A)				4 months @ 5°C; >6 months @ -20°C	Medium
IQ-3D MODEL 5010 UV	3D printing	UV-curable, metacrylic-based resin for 3D printing of dental models	1 K	Yellow - Beige
IQ-CAST 9647-FL	Potting resin	Flexible, room-temperature curable, variation in mix-ratio obtains variation in flexibility and hardness	2 K (mix-ratio 1:1 of 2:1)	Black	Low					12 months @ RT	Medium @ Low temperature
IQ-GREASE 9303	Thermal greases	lower cost, more readily available, general use version of IQ-GREASE 9302	1 K	White	Very High	Not applicable		2,8		12 months @ RT
IQ-GREASE 9302	Thermal greases	high viscosity, non-sagging, thermal interface material, typical application: dissipation of heat from bolted heatsinks onto microprocessors	1 K	White	Very High	Not applicable		3,1		12 months @ RT
IQ-CLEANER 9500	Cleaning Agents	Safe, non-toxic, water-soluble cleaning agent		Clear	Very Low	Not applicable					Low
IQ-CAST 9850-T-AB	Thermally Conductive	Thermal shock resistant, low CTE, room temperature curable, electrically insulating, thermally conductive	2 K (mix-ratio 100:3,5)	Black	High	Medium @ Low temperature		1,3		12 months @ RT	Low
IQ-BOND 9641-AB	Potting resin	High ionic purity, biomedical applications, qualifyable to BS6920 for drinking water applications	2 K (mix-ratio 100:35)	Beige	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9640	Potting resin	Low viscosity, biomedical applications, qualifyable to BS6920 for drinking water applications	2 K (mix-ratio 100:50)	Beige	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9460-FR-BLACK	Potting resin	Flame retardant UL49-VO certified potting resin	2 K (2:1 wght%)	Black	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9460-FR	Potting resin	Room temperature curable, flame retardant, very well suited for high temperature applications (140°C-150°C)	2 K (2:1 wght%)	White	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9400-AB	Potting resin	Room temperature curable, unfilled, very well suited for high temperature applications (140°C-150°C)	2 K (mix-ratio 100:18)	Clear	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9120-AB	Potting resin	Low viscosity, very well suited for high temperature applications (140°C-175°C) or extremely low temperatures (-200°C)	2 K (mix-ratio 100:58)	Clear	Very Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9100-AB	Potting resin	Very good water resistant, toughness and adhesion, meets FDA regulations permitting use in indirect food contact applications	2 K (mix-ratio 100:15)	Clear	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9044-T-AB	Thermally conductive	High thermally conductive, Room temperature cure	2 K (1:1 wght%)	Black	High	Medium @ Low temperature		1,8		12 months @ RT	Medium
IQ-CAST 9025-T-AB	Thermally Conductive	Economic, thermally conductive adhesive, for applications which require heat dissipation	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature		1,1		12 months @ RT	Medium
IQ-CAST 9024-T-AB	Thermally Conductive	Encapsulation of electronic and/or industrial components which require heat dissipation, very well suited for high temperature applications, requiring continuous protection up to 150°C	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature		1,1		12 months @ RT	Medium
IQ-BOND 8464-UV	UV-Acrylate		1 K	Clear	Very Low	Fast @ Low temperature				12 months @ RT	Low
IQ-BOND 8470-UV	UV-Acrylate	Glob top shape is required, humidity resistant	1 K	Clear	Low	Fast @ Low temperature				12 months @ 5-8°C	Medium
IQ-BOND 8462M-UV	UV-Acrylate	Optimized version of IQ-BOND-8462-UV for cure at 405 mm	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5-8°C	Low
IQ-BOND 8462-UV	UV-Acrylate	High adhesion strength, hardness, humidity resistant, optical transparency, flexibility, CTE mismatch substrates bondline	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5-8°C	Low
IQ-BOND 8422-UV	UV-Acrylate	High adhesion, high hardness, non yellowing, good humidity resistance, medium shore hardness	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5°C-25°C	Low
IQ-BOND 8416-UV	UV-Acrylate	High adhesion strength, hardness, humidity resistant, UV-curable	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5-8°C	Low
IQ-BOND 5973-ACE	Electrically conductive adhesive (Anisotropic)	SNAP-cure, long work life	1 K	Brown	Low	Fast @ High temperature				6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 5970-ACE	Electrically conductive adhesive (Anisotropic)	Fast-cure, heat-curing adhesive for Flip Chip Attach, thermode-curing process, high curing speeds	1 K	Brown	Low	Fast @ High temperature				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5601-CE	Electrically conductive adhesive (Isotropic)	Low curing temperatures, easy mix ratio, good conductivity even cured at RT, long shelf life	2 K (1:1 wght%)	Silver	Medium	Medium @ Low temperature				12 months @ RT	Medium
IQ-BOND 5600-CE-SMP	Electrically conductive adhesive (Isotropic)	Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards), smaller and more uniform particle size version of IQ-BOND 5600-CE	2 K (100:2,5 wght%)	Silver	High	Medium @ Low temperature				6 months @ RT	High
IQ-BOND 5600-CE	Electrically conductive adhesive (Isotropic)	Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards)	2 K (mix-ratio 100:2,5)	Silver	High	Medium @ Low temperature				6 months @ RT	High
IQ-BOND 5409-CE	Electrically conductive adhesive (Isotropic)	Modified version IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finisches such as Sn, SnPb, OSP-Cu, etc.	1 K	Silver	Very High	Fast @ High temperature				3 months @ -20°C; 6 months @ -40°C	TBD
IQ-BOND 5408-CE	Electrically conductive adhesive (Isotropic)	Modified version of IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finishes such as Sn, SnPb, OSP-Cu etc.	1 K	Silver	Very High	Fast @ High temperature				3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 5404-HV-CE	Electrically conductive adhesive (Isotropic)	Dispensing and jetting through very fine needles, low temperature, higher viscosity version of IQ-BOND 5404-CE	1 K	Silver	140.000 mPa.s	60 min @ 150°C / 120 min @ 120°C			24 hrs	3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 5404-CE	Electrically conductive adhesive (Isotropic)	Dispensing and jetting through very fine needles, low temperature	1 K	Silver	35.000 mPa.s	60 min @ 150°C / 120 min @ 120°C			48 hrs	3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5402-CE	Electrically conductive adhesive (Isotropic)	Short curing cycles, good electrical conductivity, high speed small dot dispensing, lower viscosity version of IQ-BOND 5402-CE	1 K	Silver	78.000 mPa.s	5 min @ 150°C / 15 min @ 120°C			24 hrs	3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5401-CE	Electrically conductive adhesive (Isotropic)	Short curing cycles, good electrical conductivity, high speed small dot dispensing	1 K	Silver	Very High	Fast @ High temperature				6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 5132-CE	Electrically conductive adhesive (Isotropic)	Flexible, dispensing/printing/stamping, electrically conductive version of IQ-BOND 2132	1 K	Silver	15.000 mPa.s	15 min @ 175°C / 90 min @ 120°C			12 hrs	6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 3401	SMD-adhesive	High speed dispensing/jetting applications, high reactivity versus low exotherm, long worklife	1 K	Red	High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 3400	SMD-adhesives	Stencil/screen printing applications, resists temperatures over 200°C for short periods of time, long potlife	1 K	Red	Very High	Fast @ High temperature		0,3		6 months @ 8°C	High
IQ-BOND 3202	SMD-adhesives	High speed stencil and/or screen printing applications, low temperature	1 K	Red	Very High	Fast @ High temperature; Medium @ Medium temperature				4 months @ 5°C; 6 months @ -20°C	High
IQ-BOND 3200	SMD-adhesive	Stencil printing applications, dispensing-high jetting processes, fast cure at low temperature	1 K	Red	High	Fast @ High temperature; Medium @ Medium temperature				4 months @ 5°C; 6 months @ -20°C	High
IQ-BOND 2801-T	Thermally conductive	Non-flow/non-sagging, higher viscosity/higher thyxo version of IQ-BOND 2800-T	1 K	White	Very High	Other		1,2		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	High
IQ-BOND 2800-T	Thermally conductive	Optimized for dispensing, long potlife, fine filler for thin bondline	1 K	White	High	Other		1		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	High
IQ-BOND 2640-WH-MFC-AB	Structural adhesive	White version of IQ-BOND 2640-FC	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature				12 months @ RT	Medium
IQ-BOND 2640-FC-Black	Structural adhesive	Black version of the IQ-BOND 2640-FC	2 K (1:1 wght%)	Black	Medium	Fast @ Low temperature				12 months @ RT	Medium
IQ-BOND 2640-FC	Structural adhesive	Fast, room temperature curable adhesive, good adhesion strenght	2 K (1:1 wght%)	Yellow	Medium	Fast @ Low temperature				12 months @ RT	Medium
IQ-BOND 2612-T-FC	Thermally Conductive	Fast cure, thermo-couple bonding, faster version of IQ-BOND 2611-T-FC	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature		1,3		12 months @ RT	Medium
IQ-BOND 2611-T-FC	Thermally conductive	Fast cure, thermo-couple bonding	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature		1,2		12 months @ RT	Medium
IQ-BOND 2610-T-AB	Thermally Conductive	Room-temperature curable, non-sagging, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C)	2 K (mix-ratio 100:39)	Black	Very High	Fast @ Low Temperature		1,3		12 months @ RT	Medium
IQ-BOND 2609-T-AB	Thermally Conductive	Very fast curable, non-sagging, high viscosity, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C)	2 K (4:1 wght%)	Black	Very High	Fast @ Low temperature		0,9		12 months @ RT	Medium
IQ-BOND 2538	Glob Top encapsulant	Dispensing, printing, stamping processes, high adhesion strength, allows temperatures between - 50°C and +200°C	1 K	Black	Very High	Other		0,5		6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2517	Glob Top Encapsulant	Non-Bleeding, exceptional reliability performance in harsh environment, dispense applications	1 K	Black	Medium	Other				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2516	Glob Top Encapsulant	Small particles, high filler loading with thyxotropic behavior during dispensing process, curing cycling requirements from -65°C up to +160°C	1 K	Black	Medium	Other				3 months @ -20°C; 6 months @ -40°C
IQ-BOND 2515	Glob Top Encapsulant	Lower shrinkage, higher filler loading version of IQ-BOND 2514	1 K	Black	Medium	60 min @ 165°C				3 months @ -20°C; 6 months @ -40°C	Low
IQ-BOND 2514	Glob Top encapsulant	Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 and 2513, optimized for applications where flow is required	1 K	Black	Low	Other				3 months @ -20°C; 6 months @ -40°C	Low
IQ-BOND 2513	Glob Top Encapsulant	Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512	1 K	Black	Low	Other				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2512	Glob Top Encapsulant	Thermal cycling requirements from -65°C up to +160°C, dispensable, use in combination with IQ-BOND 2504 possible	1 K	Black	Low	Other				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2505	Glob Top Encapsulant	Slightly less thyxotropic version of IQ-BOND 2504	1 K	Black	TBD	Other				3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 2504	Glob Top Encapsulant	Non-flow/non-sagging, dispensable, suitable for thermal cycling requirements from -65°C up to + 160°C	1 K	Black	Very High	Other				3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 2476	Underfill encapsulants	Low CTE, NASA certified (meets NASA outgassing standards), high glass transition temperature combined with low thermal expansion	1 K	White	Medium	Medium @ High Temperature				6 months @ -40°C	Low
IQ-BOND 2473-LV	Underfill encapsulants	Low Viscosity	1 K	Black	Very Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2473	Underfill encapsulants	Low viscosity	1 K	White	Very Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2472-LV	Underfill encapsulants	Lower viscosity version of IQ-BOND 2472, for improved flow	1 K	White	Very Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2472	Underfill encapsulants	Low viscosity	1 K	White	Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2432-LV-T	Thermally conductive	Flexible dielectric, thermally conductive, non-abrasive filler, high adhesion strength, lower viscous version of IQ-BOND 2432-	1 K	White	Medium	Other		0,9		6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2432-T	Thermally Conductive	Dispensing, printing, stamping processes, high adhesion strength, based on very fine non-abrasive filler technology	1 K	White	50.000 mPa.s	15 min @ 175°C / 60 min @ 150°C / 90 min @ 120°C		0,9	12 hrs	6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2409-LV	Underfill encapsulants	Lower viscosity version of IQ-BOND 2409 for improved flow	1 K	Black	Low	Fast @ High temperature				5 months @ < 5°C; 12 months @ -20	Low
IQ-BOND 2409	Underfill encapsulants	Low viscous, fast cure underfill adhesive, very long potlife	1 K	Black	Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2408	structural adhesive	Medium viscous, fast cure adhesive, resist temperature over 200°C for short periods of time	1 K	Brown	Medium	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Medium
IQ-BOND 2402-Black	SMD-adhesives	Black version of the IQ-BOND 2400	1 K	Black	Very High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 2401	SMD-adhesives	High speed dispensing; good green strength, low exotherm	1 K	Yellow	High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 2400	SMD-adhesives	Stencil printing applications, good green strength, resists temperatures over 200°C for shorts periods of time	1 K	Yellow	Very High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 2280	Glob Top Encapsulant	80°C cure, needles for dispinsing of >400µm	1 K	Black	Medium	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C	Medium
IQ-BOND 2243-FR-MT	Flame retardant materials	Low temperature cure adhesive, medium-thyxo, good green strength	1 K	Black	Very High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2242-FR-HT	Flame retardant materials	low temperature cure adhesive, high-thyxo, good green strength	1 K	Black	Very High	30 min @ 80°C				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2238-T	Thermally conductive	Low temperature cure adhesive, long potlife, very fast curing cycles, medium viscosity	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature		0,7 - 0,8		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2236-T	Thermally conductive	Low temperature adhesive, long potlife, very fast curing cycles	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature		0,6-0,7		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2235-T	Thermally conductive	Non-sagging-adhesive	1 K	White	Very High	Fast @ High temperature; Medium @ Medium temperature		1,1		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2234-T	Thermally conductive	Optimized for small dot dispensing, very fast curing cycles	1 K	Milky	Medium	Fast @ High temperature; Medium @ Medium temperature		0,9		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ- BOND 2232-T	Thermally conductive	Optimized for small dot dispensing, very fast curing cycles	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature		0,9		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2132-T	Thermally conductive	Economic, thermally conductive adhesive with a long potlife	1 K	White	Low	Fast @ High temperature; Medium @ Medium temperature		0,6-0,7		2 months - 5°C; 6 months - -20°C; 12 months - -40°	Medium
IQ-BOND 2203	SMD-adhesives	Higher viscosity SMD adhesive for stencil printing; Yellow version of IQ-BOND 3203	1 K	Yellow	Very High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2202	SMD-adhesives	Higher viscosity version of IQ-BOND 2200	1 K	Yellow	Very High	Fast @ High temperature; Medium @ Medium temperature				4 months @ 5°C	High
IQ-BOND 2201	SMD-adhesives	Lower viscosity version of IQ-BOND 2200	1 K	Yellow	High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2200	SMD-adhesive	80°c-cure; bonding on PET/PEN	1 K	Yellow	High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2177	Underfill encapsulants	Thermally conductive underfill, thermal conductivity: 0,8-0,9 W/m.K)	1 K	White	Low	Other				12 months @ -40°C	Low
IQ-BOND 2176	Underfill encapsulants	High Tg; low viscosity underfill for high temperature applications	1 K	White	Low	Other				12 months @ -40°C	Low
IQ-BOND 2175	Underfill encapsulants	Very low viscosity, for very small bondlines < 5 µm	1 K	Clear	low	Fast @ Low temperature				12 months @ -40°C	Low
IQ-BOND 2132	Structural adhesive	Flexible; low stress; dielectric adhesive; High temperature resistance	1 K	Yellow	Medium	Medium @ High temperature				6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 1402-WHLV	Underfill encapsulants	White reflective underfill; fast cure	1 K	White	low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 1632-T	Thermally conductive	Easy mix-ratio 1:1; flexible for CTE mismatch; high temperature resistance (200°C)	2 K (1:1 wght%)	grey	High	Medium @ High temperature		1,1-1,2		12 months @ 25°C	Medium
IQ- BOND 1501-T	Thermally conductive	Alumina-filled, economic, long potlife (>1 week)	1 K	White	Medium	Medium @ Medium temperature		0.8-0.9		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	Medium
IQ-BOND 1625-T	Thermally conductive	Easy mix ratio 1:1, low shrinkage	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature		1,1-1,2		12 months @ 25°C	Low

Materiali di sinterizzazione

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