Thermal Gap-fillers
Our liquid gap-filler materials were developed for high reliability automotive and industrial applications for harsh environments. In contrast to more traditional thermal pads, Roartis IQ-BOND liquid gap filler solutions offer distinct advantages, such as excellent thermal dissipation, vibration resistance, silicon-free chemistry to avoid possible contamination of sensitive electronic parts, and high adhesion.
| Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
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https://www.iq-bond.com/products/iq-bond-2650-t-fl/ compare |
IQ-BOND 2650-T-FL | Thermally conductive gapfiller | High Viscosity, non sagging, fast cure, flexible | 2K | Light Red | High | 12 months @ RT |
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https://www.iq-bond.com/products/iq-bond-2647-t-fl/ compare |
IQ-BOND 2647-T-FL | Thermally Conductive | solvent-free, two-component, thermally conductive, epoxy based adhesive, developed for “low stress applications” | 2 K (1:1 wght%) | Dark orange / Red | High | Medium @ Low temperature | 0.8 | Low |
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https://www.iq-bond.com/products/iq-bond-2649-t-fl/ compare |
IQ-BOND 2649-T-FL | Thermally conductive | High viscosity, Non-Sagging, Very Flexible, 2-komponent | 2 K (1:1 wght%) | Dark orange / Red | Very High | Medium @ Low temperature | 1.3 | 12 months @ RT | High |
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https://www.iq-bond.com/products/iq-bond-2648-t-fl/ compare |
IQ-BOND 2648-T-FL | Thermally conductive | very flexible, solvent-free, two-component, thermally conductive, epoxy based adhesive and/or gapfiller, developed for “low stress applications” | 2 K | Dark orange / Red | Medium | Medium @ Low temperature | 1.1 | 12 months @ RT | Medium |
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