Electrically conductive adhesives (ANISOTROPIC)
Roartis® offers both isotropically conductive adhesives (conducting in 3 dimensions), as well as anisotropically conductive adhesives (conducting only in the z-direction).
Anisotropic conductive adhesives are typically used in applications where flip chip devices are interconnected to substrates where very small pitches are required. Roartis® offers a range of materials with spot-cure chemistry for extreme short curing cycles, as well as materials which cure at slower rates, but which feature exceptional high adhesion strength and best-in class corrosion-resistance.
Unlike traditional suppliers, which often offer anisotropic conductive adhesives, based on Nickel filler technology, considered as carcinogenic, Roartis® has chosen to use other fillers which are more environmental friendly, as well as not harmful to the human body.
In case you don’t find a product which exactly meets your requirements, don’t hesitate to contact us to discuss the possibility of a customized development.
Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
https://www.iq-bond.com/products/iq-bond-5973-ace/ compare |
IQ-BOND 5973-ACE | Electrically conductive adhesive (Anisotropic) | SNAP-cure, long work life | 1 K | Brown | Low | Fast @ High temperature | 6 months @ -20°C; 12 months @ -40°C | Medium |
| |||||||
https://www.iq-bond.com/products/iq-bond-5970-ace/ compare |
IQ-BOND 5970-ACE | Electrically conductive adhesive (Anisotropic) | Fast-cure, heat-curing adhesive for Flip Chip Attach, thermode-curing process, high curing speeds | 1 K | Brown | Low | Fast @ High temperature | 3 months @ -20°C; 6 months @ -40°C | Medium |
|