Hohe Temperaturen verkraften

Mikroelektronische Klebstoffe auf Basis einer modifizierten Epoxyhybridchemie mit einer Tg (Glasdurchlässigkeitstemperatur) von 250°C eignen sich als Alternative zu den derzeit weit verbreiteten polyimid- und/oder nonylphenolhaltigen Polyimid- und/oder Cyanatestermaterialien.

1 of 2 Components

Viscosity

Thyxotropie

Cure

Color

Product	Product group	Strong points	One komponent or two komponents	Color	Viscosity	Tg	Storage	Thyxotropie
IQ-BOND 2580	High Temperature Resistant	High tg, dam adhesive, high reliability	1K	Black	High	High	6 months @ -40°C
IQ-COAT 6000	High temperature resistant	Solvent based, high temperature resistant coating for industrial and electronic applications	1 K	Transparant	Low		12 months @ RT
IQ-BOND 2487	High temperature resistant	Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive	1 K	Milky - Beige	Medium		3 months @ -20°C; 6 months @ -40°C
IQ-BOND 5481-CE	Electrically conductive adhesive (Isotropic)	For high temperature applications	1 K	Silver	Medium		3 months @ -20°C; 6 months @ -40°C
IQ-BOND 2481	Underfill encapsulants	high reliability, thermal cycling from -65°C up to 200°C possible	1 K	Black	Medium		3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2178	Underfill encapsulants	resists temperatures over 200°C	1 K	Milky - Beige	Medium		6 months @ -40°C	Low
IQ-BOND 2520	Glob Top encapsulant	High Tg (~250°C), for high reliability, high temperature applications	1 K	Black	High		6 months @ -40°C

Hohe Temperaturen verkraften

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