IQ-BOND 2176



IQ-BOND 2176
Product group Underfill encapsulants
Strong points High Tg; low viscosity underfill for high temperature applications
One Komponent or two komponents 1 K
Color White
Viscosity Low
Cure Other
CTE
Tg
Shore Hardness
Thermal conductivity
Work life
Storage 12 months @ -40°C
Fineness (µm)
Density (gr/cc)
Thyxotropie Low
Datasheet