IQ-BOND 2177
| IQ-BOND 2177 | |
|---|---|
| Product group | Underfill encapsulants |
| Strong points | Thermally conductive underfill, thermal conductivity: 0,8-0,9 W/m.K) |
| One Komponent or two komponents | 1 K |
| Color | White |
| Viscosity | Low |
| Cure | Other |
| CTE | |
| Tg | |
| Shore Hardness | |
| Thermal conductivity | |
| Work life | |
| Storage | 12 months @ -40°C |
| Fineness (µm) | |
| Density (gr/cc) | |
| Thyxotropie | Low |
| Datasheet |
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