IQ-BOND 2178



IQ-BOND 2178
Product group Underfill encapsulants
Strong points resists temperatures over 200°C
One Komponent or two komponents 1 K
Color Milky - Beige
Viscosity Medium
Cure
CTE
Tg
Shore Hardness
Thermal conductivity
Work life
Storage 6 months @ -40°C
Fineness (µm)
Density (gr/cc)
Thyxotropie Low
Datasheet