IQ-BOND 2409



IQ-BOND 2409
Product group Underfill encapsulants
Strong points Low viscous, fast cure underfill adhesive, very long potlife
One Komponent or two komponents 1 K
Color Black
Viscosity Low
Cure Fast @ High temperature
CTE
Tg
Shore Hardness
Thermal conductivity
Work life
Storage 4 months @ 5°C; 12 months @ -20°C
Fineness (µm)
Density (gr/cc)
Thyxotropie Low
Datasheet