IQ-BOND 2481



IQ-BOND 2481
Product group Underfill encapsulants
Strong points high reliability, thermal cycling from -65°C up to 200°C possible
One Komponent or two komponents 1 K
Color Black
Viscosity Medium
Cure
CTE
Tg
Shore Hardness
Thermal conductivity
Work life
Storage 3 months @ -20°C; 6 months @ -40°C
Fineness (µm)
Density (gr/cc)
Thyxotropie Medium
Datasheet