IQ-BOND 2487



IQ-BOND 2487
Product group High temperature resistant
Strong points Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive
One Komponent or two komponents 1 K
Color Milky - Beige
Viscosity 18.000 mPa.s
Cure Multiple stage cure: 2hrs @ 90°C + 3hrs @ 150°C
CTE
Tg 230° C
Shore Hardness
Thermal conductivity
Work life
Storage 3 months @ -20°C; 6 months @ -40°C
Fineness (µm)
Density (gr/cc)
Thyxotropie
Datasheet