IQ-BOND 2487
| IQ-BOND 2487 | |
|---|---|
| Product group | High temperature resistant |
| Strong points | Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive |
| One Komponent or two komponents | 1 K |
| Color | Milky - Beige |
| Viscosity | 18.000 mPa.s |
| Cure | Multiple stage cure: 2hrs @ 90°C + 3hrs @ 150°C |
| CTE | |
| Tg | 230° C |
| Shore Hardness | |
| Thermal conductivity | |
| Work life | |
| Storage | 3 months @ -20°C; 6 months @ -40°C |
| Fineness (µm) | |
| Density (gr/cc) | |
| Thyxotropie | |
| Datasheet |
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