IQ-BOND 5409-CE
| IQ-BOND 5409-CE | |
|---|---|
| Product group | Electrically conductive adhesive (Isotropic) |
| Strong points | Modified version IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finisches such as Sn, SnPb, OSP-Cu, etc. |
| One Komponent or two komponents | 1 K |
| Color | Silver |
| Viscosity | Very High |
| Cure | Fast @ High temperature |
| CTE | |
| Tg | |
| Shore Hardness | |
| Thermal conductivity | |
| Work life | |
| Storage | 3 months @ -20°C; 6 months @ -40°C |
| Fineness (µm) | |
| Density (gr/cc) | |
| Thyxotropie | TBD |
| Datasheet |
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