IQ-BOND 5409-CE
IQ-BOND 5409-CE | |
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Product group | Electrically conductive adhesive (Isotropic) |
Strong points | Modified version IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finisches such as Sn, SnPb, OSP-Cu, etc. |
One Komponent or two komponents | 1 K |
Color | Silver |
Viscosity | Very High |
Cure | Fast @ High temperature |
CTE | |
Tg | |
Shore Hardness | |
Thermal conductivity | |
Work life | |
Storage | 3 months @ -20°C; 6 months @ -40°C |
Fineness (µm) | |
Density (gr/cc) | |
Thyxotropie | TBD |
Datasheet |
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