IQ-BOND 5970-ACE
| IQ-BOND 5970-ACE | |
|---|---|
| Product group | Electrically conductive adhesive (Anisotropic) |
| Strong points | Fast-cure, heat-curing adhesive for Flip Chip Attach, thermode-curing process, high curing speeds |
| One Komponent or two komponents | 1 K |
| Color | Brown |
| Viscosity | Low |
| Cure | Fast @ High temperature |
| CTE | |
| Tg | |
| Shore Hardness | |
| Thermal conductivity | |
| Work life | |
| Storage | 3 months @ -20°C; 6 months @ -40°C |
| Fineness (µm) | |
| Density (gr/cc) | |
| Thyxotropie | Medium |
| Datasheet |
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