Underfill
Underfills sind normalerweise Materialien auf Epoxidbasis, die in elektronischen Baugruppen verwendet werden, um die Lücke zwischen den BGA-, CSP- oder Flip-Chip-Komponenten und der Leiterplatte zu füllen. Somit sind die Komponenten gegen Stöße, Stürze, thermische Zyklen und Vibrationsbelastung geschützt.
Roartis® bietet unterschiedliche Kapillare Underfills mit einzigartigen Eigenschaften wie hohe Tg, niedrige CTE und gute Fließfähigkeit (für Anwendungen mit sehr kleinen Löchern).
Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
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https://www.iq-bond.com/products/iq-bond-2481/ compare |
IQ-BOND 2481 | Underfill encapsulants | high reliability, thermal cycling from -65°C up to 200°C possible | 1 K | Black | Medium | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2178/ compare |
IQ-BOND 2178 | Underfill encapsulants | resists temperatures over 200°C | 1 K | Milky - Beige | Medium | 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2476/ compare |
IQ-BOND 2476 | Underfill encapsulants | Low CTE, NASA certified (meets NASA outgassing standards), high glass transition temperature combined with low thermal expansion | 1 K | White | Medium | Medium @ High Temperature | 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2473-lv/ compare |
IQ-BOND 2473-LV | Underfill encapsulants | Low Viscosity | 1 K | Black | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2473/ compare |
IQ-BOND 2473 | Underfill encapsulants | Low viscosity | 1 K | White | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2472-lv/ compare |
IQ-BOND 2472-LV | Underfill encapsulants | Lower viscosity version of IQ-BOND 2472, for improved flow | 1 K | White | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2472/ compare |
IQ-BOND 2472 | Underfill encapsulants | Low viscosity | 1 K | White | Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2409-lv/ compare |
IQ-BOND 2409-LV | Underfill encapsulants | Lower viscosity version of IQ-BOND 2409 for improved flow | 1 K | Black | Low | Fast @ High temperature | 5 months @ < 5°C; 12 months @ -20 | Low |
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https://www.iq-bond.com/products/iq-bond-2409/ compare |
IQ-BOND 2409 | Underfill encapsulants | Low viscous, fast cure underfill adhesive, very long potlife | 1 K | Black | Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2177/ compare |
IQ-BOND 2177 | Underfill encapsulants | Thermally conductive underfill, thermal conductivity: 0,8-0,9 W/m.K) | 1 K | White | Low | Other | 12 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2176/ compare |
IQ-BOND 2176 | Underfill encapsulants | High Tg; low viscosity underfill for high temperature applications | 1 K | White | Low | Other | 12 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2175/ compare |
IQ-BOND 2175 | Underfill encapsulants | Very low viscosity, for very small bondlines < 5 µm | 1 K | Clear | low | Fast @ Low temperature | 12 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-1402-whlv/ compare |
IQ-BOND 1402-WHLV | Underfill encapsulants | White reflective underfill; fast cure | 1 K | White | low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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