“Glob top” – “Dam & Fill” Harze
In vielen elektronischen Baugruppen erfordern empfindliche Komponenten wie Chips, RF-Komponenten von Quarzoszillatoren, BGAs und CSPs zuverlässigen Schutz gegen aggressive Umgebungen.
Roartis® Epoxid-basierte “Glob Top” – und “Dam & Fill” -Harze mit hohem Tg und niedrigem CTE werden in anspruchsvollen Anwendungen eingesetzt, in denen Kunden eine Beständigkeit gegen thermische Zyklen zwischen -55 ° C und 180 ° C benötigen. Auch umfangreiche Tests zur Feuchtebelastung (2000 Std. 85 ° C / 85% RH) haben sich für Roartis® “glob top” oder “dam & fill” Materialien als kein Hindernis erwiesen.
Wo “dam & fill”-Harze typischerweise für größere Chipanwendungen verwendet werden, werden “glob top” -Harze meistens für kleinere Chips verwendet. Um die Prozesszeit zu minimieren, wurde die Chemie der “dam & fill” -Vergussmassen optimiert, um einen Co-Härtungsprozess zu ermöglichen.
| Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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https://www.iq-bond.com/products/iq-bond-7292-uv/ compare |
IQ-BOND 7292 UV | UV-Acrylate, Glob Top | One component, medium viscosity, medium thixotropy, epoxy-based, UV-curable GLOB-TOP adhesive | 1 K | White | Medium | ~30 seconds at 120 mW/cm² for a 500 μm thick layer (UV-A) | 4 months @ 5°C; >6 months @ -20°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2538/ compare |
IQ-BOND 2538 | Glob Top encapsulant | Dispensing, printing, stamping processes, high adhesion strength, allows temperatures between - 50°C and +200°C | 1 K | Black | Very High | Other | 0,5 | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2517/ compare |
IQ-BOND 2517 | Glob Top Encapsulant | Non-Bleeding, exceptional reliability performance in harsh environment, dispense applications | 1 K | Black | Medium | Other | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2516/ compare |
IQ-BOND 2516 | Glob Top Encapsulant | Small particles, high filler loading with thyxotropic behavior during dispensing process, curing cycling requirements from -65°C up to +160°C | 1 K | Black | Medium | Other | 3 months @ -20°C; 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-2515/ compare |
IQ-BOND 2515 | Glob Top Encapsulant | Lower shrinkage, higher filler loading version of IQ-BOND 2514 | 1 K | Black | Medium | 60 min @ 165°C | 3 months @ -20°C; 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2514/ compare |
IQ-BOND 2514 | Glob Top encapsulant | Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 and 2513, optimized for applications where flow is required | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2513/ compare |
IQ-BOND 2513 | Glob Top Encapsulant | Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2512/ compare |
IQ-BOND 2512 | Glob Top Encapsulant | Thermal cycling requirements from -65°C up to +160°C, dispensable, use in combination with IQ-BOND 2504 possible | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2505/ compare |
IQ-BOND 2505 | Glob Top Encapsulant | Slightly less thyxotropic version of IQ-BOND 2504 | 1 K | Black | TBD | Other | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2504/ compare |
IQ-BOND 2504 | Glob Top Encapsulant | Non-flow/non-sagging, dispensable, suitable for thermal cycling requirements from -65°C up to + 160°C | 1 K | Black | Very High | Other | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2280/ compare |
IQ-BOND 2280 | Glob Top Encapsulant | 80°C cure, needles for dispinsing of >400µm | 1 K | Black | Medium | Fast @ High temperature; Medium @ Medium temperature | 6 months @ <5°C | Medium |
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