Elektrisch Leitfähiger Klebstoffe (ISOTROP)
Roartis® bietet sowohl isotrop leitfähige Klebstoffe (in 3 Dimensionen leitend) als auch anisotrop leitfähige Klebstoffe (nur in z-Richtung leitend) an.
In unserer Familie der elektrisch leitfähigen Klebstoffe bieten wir Materialien an, deren Rheologie für das Dispensieren, Spritzen, Schablonieren oder Siebdruck und / oder Stempeln optimiert ist. Typische Anwendungen umfassen z.b. das Verbinden von mikroelektronischen Komponenten auf temperaturempfindlichen Substraten, wie etwa flexiblen Schaltungen, oder das Ersetzen von Lötpasten in Anwendungen, in denen eine erhöhte Flexibilität erforderlich ist.
Elektrisch leitfähige Klebstoffe eignen sich hervorragend als Alternative zu spröden Lötpasten in Anwendungen, bei denen große thermische Zyklen erforderlich sind.
Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
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https://www.iq-bond.com/products/iq-bond-5481-ce/ compare |
IQ-BOND 5481-CE | Electrically conductive adhesive (Isotropic) | For high temperature applications | 1 K | Silver | 15.000 mPa.s | Multiple stage cure: 2 hrs @ 90°C + 3 hrs @ 150°C | 230°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-5601-ce/ compare |
IQ-BOND 5601-CE | Electrically conductive adhesive (Isotropic) | Low curing temperatures, easy mix ratio, good conductivity even cured at RT, long shelf life | 2 K (1:1 wght%) | Silver | Medium | Medium @ Low temperature | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-5600-ce-smp/ compare |
IQ-BOND 5600-CE-SMP | Electrically conductive adhesive (Isotropic) | Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards), smaller and more uniform particle size version of IQ-BOND 5600-CE | 2 K (100:2,5 wght%) | Silver | High | Medium @ Low temperature | 6 months @ RT | High |
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https://www.iq-bond.com/products/iq-bond-5600-ce/ compare |
IQ-BOND 5600-CE | Electrically conductive adhesive (Isotropic) | Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards) | 2 K (mix-ratio 100:2,5) | Silver | High | Medium @ Low temperature | 6 months @ RT | High |
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https://www.iq-bond.com/products/iq-bond-5409-ce/ compare |
IQ-BOND 5409-CE | Electrically conductive adhesive (Isotropic) | Modified version IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finisches such as Sn, SnPb, OSP-Cu, etc. | 1 K | Silver | Very High | Fast @ High temperature | 3 months @ -20°C; 6 months @ -40°C | TBD |
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https://www.iq-bond.com/products/iq-bond-5408-ce/ compare |
IQ-BOND 5408-CE | Electrically conductive adhesive (Isotropic) | Modified version of IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finishes such as Sn, SnPb, OSP-Cu etc. | 1 K | Silver | Very High | Fast @ High temperature | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-5404-hv-ce/ compare |
IQ-BOND 5404-HV-CE | Electrically conductive adhesive (Isotropic) | Dispensing and jetting through very fine needles, low temperature, higher viscosity version of IQ-BOND 5404-CE | 1 K | Silver | 140.000 mPa.s | 60 min @ 150°C / 120 min @ 120°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-5404-ce/ compare |
IQ-BOND 5404-CE | Electrically conductive adhesive (Isotropic) | Dispensing and jetting through very fine needles, low temperature | 1 K | Silver | 35.000 mPa.s | 60 min @ 150°C / 120 min @ 120°C | 48 hrs | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5402-ce/ compare |
IQ-BOND 5402-CE | Electrically conductive adhesive (Isotropic) | Short curing cycles, good electrical conductivity, high speed small dot dispensing, lower viscosity version of IQ-BOND 5402-CE | 1 K | Silver | 78.000 mPa.s | 5 min @ 150°C / 15 min @ 120°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5401-ce/ compare |
IQ-BOND 5401-CE | Electrically conductive adhesive (Isotropic) | Short curing cycles, good electrical conductivity, high speed small dot dispensing | 1 K | Silver | Very High | Fast @ High temperature | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-5132-ce/ compare |
IQ-BOND 5132-CE | Electrically conductive adhesive (Isotropic) | Flexible, dispensing/printing/stamping, electrically conductive version of IQ-BOND 2132 | 1 K | Silver | 15.000 mPa.s | 15 min @ 175°C / 90 min @ 120°C | 12 hrs | 6 months @ -20°C; 12 months @ -40°C | High |
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