Die-Attach-Klebstoffe

Innerhalb des ROARTIS®-Sortiments an elektrischen und isolierenden Klebstoffen verfügen verschiedene Produkte über eine Rheologie, die für die Die-Attach-Anwendung optimiert ist. Unsere elektrisch leitfähigen und isolierenden Klebstoffe sind für das Auftragen oder Spritzen mit hoher Geschwindigkeit optimiert.

1 of 2 Components

Viscosity

Thyxotropie

Cure

Color

Product	Product group	Strong points	One komponent or two komponents	Color	Viscosity	Cure	Tg	Thermal conductivity	Work life	Storage	Thyxotropie
IQ-BOND 8429-BLUE UV	Dielectric Ink	UV Acrylate / Bridging coating in printed electronics (RFID antenna’s)		Green	30.000 mPa.s					12 months
IQ-BOND 8429-BLUE UV	Dielectric Ink	UV Acrylate / Bridging coating in printed electronics (RFID antenna’s)		Blue	28.000 mPa.s					12 months
IQ-INQ 1202	Electrically Conductive Ink	Standard for Screen printing, Economical		Gray	21.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1201	Electrically Conductive Ink	Standard for Screen printing, Economical		Light Brown	20.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1100	Electrically Conductive Ink	Standard for Screen printing		Black	36.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1002	Electrically Conductive Ink	Excellent Elongation		Silver	15.000 mPa.s	15 min @ 120°C				12 months
IQ-INQ 1000	Electrically Conductive Ink	Standard for Screen printing, Economical		Silver	15.000 mPa.s	15 min @ 120°C				12 months
IQ-SINTER 5461	Sinter paste	High thermally & electrically conductive (> 200 W/m.K , 5 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering		Silver	160.000 mPa.s	Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C			12 hrs
IQ-SINTER 5460	Sinter paste	High thermally & electrically conductive (> 200 W/m.K , 4 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering		Silver	53.000 mPa.s	Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C			24 hrs
IQ-BOND 5451-HSCE	Hybrid sinter paste	High speed, fine dot dispensing Higher viscosity & improved electrically conductivity version of IQ-BOND 5450-HSCE (> 60 W/m.K , 3,8 x 10-6 Ohm.cm)		Silver	45.000 mPa.s	Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C			12 hrs
IQ-BOND 5450-HSCE	Hybrid sinter paste	High speed, fine dot dispensing High thermally & electrically conductivity (> 60 W/m.K , 9 x 10-6 Ohm.cm)		Silver	20.000 mPa.s	Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C			12 hrs
IQ-BOND 2722	Insulating	Fast cure, dispensing or jetting processes, Low temperature die attach for flex substrates		Bright Yellow	100.000 mPa.s	60 min @ 80°C			5 days
IQ-BOND 2705	Insulating	Fast cure, dispensing or jetting processes, thermode or conveyor belt oven, fastest version based on hybrid epoxy chemistry		Beige	35.000 mPa.s	1 min @ 150°C / 5 sec @ 170°C			2 days
IQ-BOND 2700	Insulating	Fast cure, dispensing or jetting processes, thermode or conveyor belt oven		Milky/clear	10.000 mPa.s	5 min @ 120°C / 10 sec @ 170°C			5 days
IQ-BOND 2580	High Temperature Resistant	High tg, dam adhesive, high reliability	1K	Black	High		High			6 months @ -40°C
IQ-BOND 2650-T-FL	Thermally conductive gapfiller	High Viscosity, non sagging, fast cure, flexible	2K	Light Red	High					12 months @ RT
IQ-COAT 6000	High temperature resistant	Solvent based, high temperature resistant coating for industrial and electronic applications	1 K	Transparant	Low					12 months @ RT
IQ-BOND 2487	High temperature resistant	Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive	1 K	Milky - Beige	18.000 mPa.s	Multiple stage cure: 2hrs @ 90°C + 3hrs @ 150°C	230° C		24 hrs	3 months @ -20°C; 6 months @ -40°C
IQ-BOND 5481-CE	Electrically conductive adhesive (Isotropic)	For high temperature applications	1 K	Silver	15.000 mPa.s	Multiple stage cure: 2 hrs @ 90°C + 3 hrs @ 150°C	230°C		24 hrs	3 months @ -20°C; 6 months @ -40°C
IQ-BOND 2481	Underfill encapsulants	high reliability, thermal cycling from -65°C up to 200°C possible	1 K	Black	Medium					3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2178	Underfill encapsulants	resists temperatures over 200°C	1 K	Milky - Beige	Medium					6 months @ -40°C	Low
IQ-BOND 2520	Glob Top encapsulant	High Tg (~250°C), for high reliability, high temperature applications	1 K	Black	High					6 months @ -40°C
IQ-BOND 2647-T-FL	Thermally Conductive	solvent-free, two-component, thermally conductive, epoxy based adhesive, developed for “low stress applications”	2 K (1:1 wght%)	Dark orange / Red	High	Medium @ Low temperature		0.8			Low
IQ-BOND 2649-T-FL	Thermally conductive	High viscosity, Non-Sagging, Very Flexible, 2-komponent	2 K (1:1 wght%)	Dark orange / Red	Very High	Medium @ Low temperature		1.3		12 months @ RT	High
IQ-BOND 2648-T-FL	Thermally conductive	very flexible, solvent-free, two-component, thermally conductive, epoxy based adhesive and/or gapfiller, developed for “low stress applications”	2 K	Dark orange / Red	Medium	Medium @ Low temperature		1.1		12 months @ RT	Medium
IQ-BOND 8424 UV	UV-Acrylate	UV-curable, flexibilized, one component, acrylic-based adhesive or coating for optical applications	1 K	Clear	Low	Fast @ Low Temperature				12 months @ 5-8°C	Low
IQ-BOND 7292 UV	UV-Acrylate, Glob Top	One component, medium viscosity, medium thixotropy, epoxy-based, UV-curable GLOB-TOP adhesive	1 K	White	Medium	~30 seconds at 120 mW/cm² for a 500 μm thick layer (UV-A)				4 months @ 5°C; >6 months @ -20°C	Medium
IQ-3D MODEL 5010 UV	3D printing	UV-curable, metacrylic-based resin for 3D printing of dental models	1 K	Yellow - Beige
IQ-CAST 9647-FL	Potting resin	Flexible, room-temperature curable, variation in mix-ratio obtains variation in flexibility and hardness	2 K (mix-ratio 1:1 of 2:1)	Black	Low					12 months @ RT	Medium @ Low temperature
IQ-GREASE 9303	Thermal greases	lower cost, more readily available, general use version of IQ-GREASE 9302	1 K	White	Very High	Not applicable		2,8		12 months @ RT
IQ-GREASE 9302	Thermal greases	high viscosity, non-sagging, thermal interface material, typical application: dissipation of heat from bolted heatsinks onto microprocessors	1 K	White	Very High	Not applicable		3,1		12 months @ RT
IQ-CLEANER 9500	Cleaning Agents	Safe, non-toxic, water-soluble cleaning agent		Clear	Very Low	Not applicable					Low
IQ-CAST 9850-T-AB	Thermally Conductive	Thermal shock resistant, low CTE, room temperature curable, electrically insulating, thermally conductive	2 K (mix-ratio 100:3,5)	Black	High	Medium @ Low temperature		1,3		12 months @ RT	Low
IQ-BOND 9641-AB	Potting resin	High ionic purity, biomedical applications, qualifyable to BS6920 for drinking water applications	2 K (mix-ratio 100:35)	Beige	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9640	Potting resin	Low viscosity, biomedical applications, qualifyable to BS6920 for drinking water applications	2 K (mix-ratio 100:50)	Beige	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9460-FR-BLACK	Potting resin	Flame retardant UL49-VO certified potting resin	2 K (2:1 wght%)	Black	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9460-FR	Potting resin	Room temperature curable, flame retardant, very well suited for high temperature applications (140°C-150°C)	2 K (2:1 wght%)	White	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9400-AB	Potting resin	Room temperature curable, unfilled, very well suited for high temperature applications (140°C-150°C)	2 K (mix-ratio 100:18)	Clear	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9120-AB	Potting resin	Low viscosity, very well suited for high temperature applications (140°C-175°C) or extremely low temperatures (-200°C)	2 K (mix-ratio 100:58)	Clear	Very Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9100-AB	Potting resin	Very good water resistant, toughness and adhesion, meets FDA regulations permitting use in indirect food contact applications	2 K (mix-ratio 100:15)	Clear	Low	Medium @ Low temperature				12 months @ RT	Low
IQ-CAST 9044-T-AB	Thermally conductive	High thermally conductive, Room temperature cure	2 K (1:1 wght%)	Black	High	Medium @ Low temperature		1,8		12 months @ RT	Medium
IQ-CAST 9025-T-AB	Thermally Conductive	Economic, thermally conductive adhesive, for applications which require heat dissipation	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature		1,1		12 months @ RT	Medium
IQ-CAST 9024-T-AB	Thermally Conductive	Encapsulation of electronic and/or industrial components which require heat dissipation, very well suited for high temperature applications, requiring continuous protection up to 150°C	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature		1,1		12 months @ RT	Medium
IQ-BOND 8464-UV	UV-Acrylate		1 K	Clear	Very Low	Fast @ Low temperature				12 months @ RT	Low
IQ-BOND 8470-UV	UV-Acrylate	Glob top shape is required, humidity resistant	1 K	Clear	Low	Fast @ Low temperature				12 months @ 5-8°C	Medium
IQ-BOND 8462M-UV	UV-Acrylate	Optimized version of IQ-BOND-8462-UV for cure at 405 mm	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5-8°C	Low
IQ-BOND 8462-UV	UV-Acrylate	High adhesion strength, hardness, humidity resistant, optical transparency, flexibility, CTE mismatch substrates bondline	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5-8°C	Low
IQ-BOND 8422-UV	UV-Acrylate	High adhesion, high hardness, non yellowing, good humidity resistance, medium shore hardness	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5°C-25°C	Low
IQ-BOND 8416-UV	UV-Acrylate	High adhesion strength, hardness, humidity resistant, UV-curable	1 K	Clear	Very Low	Fast @ Low temperature				12 months @ 5-8°C	Low
IQ-BOND 5973-ACE	Electrically conductive adhesive (Anisotropic)	SNAP-cure, long work life	1 K	Brown	Low	Fast @ High temperature				6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 5970-ACE	Electrically conductive adhesive (Anisotropic)	Fast-cure, heat-curing adhesive for Flip Chip Attach, thermode-curing process, high curing speeds	1 K	Brown	Low	Fast @ High temperature				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5601-CE	Electrically conductive adhesive (Isotropic)	Low curing temperatures, easy mix ratio, good conductivity even cured at RT, long shelf life	2 K (1:1 wght%)	Silver	Medium	Medium @ Low temperature				12 months @ RT	Medium
IQ-BOND 5600-CE-SMP	Electrically conductive adhesive (Isotropic)	Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards), smaller and more uniform particle size version of IQ-BOND 5600-CE	2 K (100:2,5 wght%)	Silver	High	Medium @ Low temperature				6 months @ RT	High
IQ-BOND 5600-CE	Electrically conductive adhesive (Isotropic)	Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards)	2 K (mix-ratio 100:2,5)	Silver	High	Medium @ Low temperature				6 months @ RT	High
IQ-BOND 5409-CE	Electrically conductive adhesive (Isotropic)	Modified version IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finisches such as Sn, SnPb, OSP-Cu, etc.	1 K	Silver	Very High	Fast @ High temperature				3 months @ -20°C; 6 months @ -40°C	TBD
IQ-BOND 5408-CE	Electrically conductive adhesive (Isotropic)	Modified version of IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finishes such as Sn, SnPb, OSP-Cu etc.	1 K	Silver	Very High	Fast @ High temperature				3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 5404-HV-CE	Electrically conductive adhesive (Isotropic)	Dispensing and jetting through very fine needles, low temperature, higher viscosity version of IQ-BOND 5404-CE	1 K	Silver	140.000 mPa.s	60 min @ 150°C / 120 min @ 120°C			24 hrs	3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 5404-CE	Electrically conductive adhesive (Isotropic)	Dispensing and jetting through very fine needles, low temperature	1 K	Silver	35.000 mPa.s	60 min @ 150°C / 120 min @ 120°C			48 hrs	3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5402-CE	Electrically conductive adhesive (Isotropic)	Short curing cycles, good electrical conductivity, high speed small dot dispensing, lower viscosity version of IQ-BOND 5402-CE	1 K	Silver	78.000 mPa.s	5 min @ 150°C / 15 min @ 120°C			24 hrs	3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5401-CE	Electrically conductive adhesive (Isotropic)	Short curing cycles, good electrical conductivity, high speed small dot dispensing	1 K	Silver	Very High	Fast @ High temperature				6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 5132-CE	Electrically conductive adhesive (Isotropic)	Flexible, dispensing/printing/stamping, electrically conductive version of IQ-BOND 2132	1 K	Silver	15.000 mPa.s	15 min @ 175°C / 90 min @ 120°C			12 hrs	6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 3401	SMD-adhesive	High speed dispensing/jetting applications, high reactivity versus low exotherm, long worklife	1 K	Red	High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 3400	SMD-adhesives	Stencil/screen printing applications, resists temperatures over 200°C for short periods of time, long potlife	1 K	Red	Very High	Fast @ High temperature		0,3		6 months @ 8°C	High
IQ-BOND 3202	SMD-adhesives	High speed stencil and/or screen printing applications, low temperature	1 K	Red	Very High	Fast @ High temperature; Medium @ Medium temperature				4 months @ 5°C; 6 months @ -20°C	High
IQ-BOND 3200	SMD-adhesive	Stencil printing applications, dispensing-high jetting processes, fast cure at low temperature	1 K	Red	High	Fast @ High temperature; Medium @ Medium temperature				4 months @ 5°C; 6 months @ -20°C	High
IQ-BOND 2801-T	Thermally conductive	Non-flow/non-sagging, higher viscosity/higher thyxo version of IQ-BOND 2800-T	1 K	White	Very High	Other		1,2		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	High
IQ-BOND 2800-T	Thermally conductive	Optimized for dispensing, long potlife, fine filler for thin bondline	1 K	White	High	Other		1		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	High
IQ-BOND 2640-WH-MFC-AB	Structural adhesive	White version of IQ-BOND 2640-FC	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature				12 months @ RT	Medium
IQ-BOND 2640-FC-Black	Structural adhesive	Black version of the IQ-BOND 2640-FC	2 K (1:1 wght%)	Black	Medium	Fast @ Low temperature				12 months @ RT	Medium
IQ-BOND 2640-FC	Structural adhesive	Fast, room temperature curable adhesive, good adhesion strenght	2 K (1:1 wght%)	Yellow	Medium	Fast @ Low temperature				12 months @ RT	Medium
IQ-BOND 2612-T-FC	Thermally Conductive	Fast cure, thermo-couple bonding, faster version of IQ-BOND 2611-T-FC	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature		1,3		12 months @ RT	Medium
IQ-BOND 2611-T-FC	Thermally conductive	Fast cure, thermo-couple bonding	2 K (1:1 wght%)	White	Medium	Fast @ Low temperature		1,2		12 months @ RT	Medium
IQ-BOND 2610-T-AB	Thermally Conductive	Room-temperature curable, non-sagging, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C)	2 K (mix-ratio 100:39)	Black	Very High	Fast @ Low Temperature		1,3		12 months @ RT	Medium
IQ-BOND 2609-T-AB	Thermally Conductive	Very fast curable, non-sagging, high viscosity, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C)	2 K (4:1 wght%)	Black	Very High	Fast @ Low temperature		0,9		12 months @ RT	Medium
IQ-BOND 2538	Glob Top encapsulant	Dispensing, printing, stamping processes, high adhesion strength, allows temperatures between - 50°C and +200°C	1 K	Black	Very High	Other		0,5		6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2517	Glob Top Encapsulant	Non-Bleeding, exceptional reliability performance in harsh environment, dispense applications	1 K	Black	Medium	Other				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2516	Glob Top Encapsulant	Small particles, high filler loading with thyxotropic behavior during dispensing process, curing cycling requirements from -65°C up to +160°C	1 K	Black	Medium	Other				3 months @ -20°C; 6 months @ -40°C
IQ-BOND 2515	Glob Top Encapsulant	Lower shrinkage, higher filler loading version of IQ-BOND 2514	1 K	Black	Medium	60 min @ 165°C				3 months @ -20°C; 6 months @ -40°C	Low
IQ-BOND 2514	Glob Top encapsulant	Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 and 2513, optimized for applications where flow is required	1 K	Black	Low	Other				3 months @ -20°C; 6 months @ -40°C	Low
IQ-BOND 2513	Glob Top Encapsulant	Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512	1 K	Black	Low	Other				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2512	Glob Top Encapsulant	Thermal cycling requirements from -65°C up to +160°C, dispensable, use in combination with IQ-BOND 2504 possible	1 K	Black	Low	Other				3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2505	Glob Top Encapsulant	Slightly less thyxotropic version of IQ-BOND 2504	1 K	Black	TBD	Other				3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 2504	Glob Top Encapsulant	Non-flow/non-sagging, dispensable, suitable for thermal cycling requirements from -65°C up to + 160°C	1 K	Black	Very High	Other				3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 2476	Underfill encapsulants	Low CTE, NASA certified (meets NASA outgassing standards), high glass transition temperature combined with low thermal expansion	1 K	White	Medium	Medium @ High Temperature				6 months @ -40°C	Low
IQ-BOND 2473-LV	Underfill encapsulants	Low Viscosity	1 K	Black	Very Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2473	Underfill encapsulants	Low viscosity	1 K	White	Very Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2472-LV	Underfill encapsulants	Lower viscosity version of IQ-BOND 2472, for improved flow	1 K	White	Very Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2472	Underfill encapsulants	Low viscosity	1 K	White	Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2432-LV-T	Thermally conductive	Flexible dielectric, thermally conductive, non-abrasive filler, high adhesion strength, lower viscous version of IQ-BOND 2432-	1 K	White	Medium	Other		0,9		6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2432-T	Thermally Conductive	Dispensing, printing, stamping processes, high adhesion strength, based on very fine non-abrasive filler technology	1 K	White	50.000 mPa.s	15 min @ 175°C / 60 min @ 150°C / 90 min @ 120°C		0,9	12 hrs	6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2409-LV	Underfill encapsulants	Lower viscosity version of IQ-BOND 2409 for improved flow	1 K	Black	Low	Fast @ High temperature				5 months @ < 5°C; 12 months @ -20	Low
IQ-BOND 2409	Underfill encapsulants	Low viscous, fast cure underfill adhesive, very long potlife	1 K	Black	Low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2408	structural adhesive	Medium viscous, fast cure adhesive, resist temperature over 200°C for short periods of time	1 K	Brown	Medium	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Medium
IQ-BOND 2402-Black	SMD-adhesives	Black version of the IQ-BOND 2400	1 K	Black	Very High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 2401	SMD-adhesives	High speed dispensing; good green strength, low exotherm	1 K	Yellow	High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 2400	SMD-adhesives	Stencil printing applications, good green strength, resists temperatures over 200°C for shorts periods of time	1 K	Yellow	Very High	Fast @ High temperature				6 months @ 8°C	High
IQ-BOND 2280	Glob Top Encapsulant	80°C cure, needles for dispinsing of >400µm	1 K	Black	Medium	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C	Medium
IQ-BOND 2243-FR-MT	Flame retardant materials	Low temperature cure adhesive, medium-thyxo, good green strength	1 K	Black	Very High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2242-FR-HT	Flame retardant materials	low temperature cure adhesive, high-thyxo, good green strength	1 K	Black	Very High	30 min @ 80°C				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2238-T	Thermally conductive	Low temperature cure adhesive, long potlife, very fast curing cycles, medium viscosity	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature		0,7 - 0,8		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2236-T	Thermally conductive	Low temperature adhesive, long potlife, very fast curing cycles	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature		0,6-0,7		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2235-T	Thermally conductive	Non-sagging-adhesive	1 K	White	Very High	Fast @ High temperature; Medium @ Medium temperature		1,1		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2234-T	Thermally conductive	Optimized for small dot dispensing, very fast curing cycles	1 K	Milky	Medium	Fast @ High temperature; Medium @ Medium temperature		0,9		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ- BOND 2232-T	Thermally conductive	Optimized for small dot dispensing, very fast curing cycles	1 K	White	Medium	Fast @ High temperature; Medium @ Medium temperature		0,9		2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 2132-T	Thermally conductive	Economic, thermally conductive adhesive with a long potlife	1 K	White	Low	Fast @ High temperature; Medium @ Medium temperature		0,6-0,7		2 months - 5°C; 6 months - -20°C; 12 months - -40°	Medium
IQ-BOND 2203	SMD-adhesives	Higher viscosity SMD adhesive for stencil printing; Yellow version of IQ-BOND 3203	1 K	Yellow	Very High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2202	SMD-adhesives	Higher viscosity version of IQ-BOND 2200	1 K	Yellow	Very High	Fast @ High temperature; Medium @ Medium temperature				4 months @ 5°C	High
IQ-BOND 2201	SMD-adhesives	Lower viscosity version of IQ-BOND 2200	1 K	Yellow	High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2200	SMD-adhesive	80°c-cure; bonding on PET/PEN	1 K	Yellow	High	Fast @ High temperature; Medium @ Medium temperature				6 months @ <5°C; 12 months @ -20°C	High
IQ-BOND 2177	Underfill encapsulants	Thermally conductive underfill, thermal conductivity: 0,8-0,9 W/m.K)	1 K	White	Low	Other				12 months @ -40°C	Low
IQ-BOND 2176	Underfill encapsulants	High Tg; low viscosity underfill for high temperature applications	1 K	White	Low	Other				12 months @ -40°C	Low
IQ-BOND 2175	Underfill encapsulants	Very low viscosity, for very small bondlines < 5 µm	1 K	Clear	low	Fast @ Low temperature				12 months @ -40°C	Low
IQ-BOND 2132	Structural adhesive	Flexible; low stress; dielectric adhesive; High temperature resistance	1 K	Yellow	Medium	Medium @ High temperature				6 months @ -20°C; 12 months @ -40°C	Medium
IQ-BOND 1402-WHLV	Underfill encapsulants	White reflective underfill; fast cure	1 K	White	low	Fast @ High temperature				4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 1632-T	Thermally conductive	Easy mix-ratio 1:1; flexible for CTE mismatch; high temperature resistance (200°C)	2 K (1:1 wght%)	grey	High	Medium @ High temperature		1,1-1,2		12 months @ 25°C	Medium
IQ- BOND 1501-T	Thermally conductive	Alumina-filled, economic, long potlife (>1 week)	1 K	White	Medium	Medium @ Medium temperature		0.8-0.9		1 month - 5°C; 6 months - -20°C; 12 months - -40°C	Medium
IQ-BOND 1625-T	Thermally conductive	Easy mix ratio 1:1, low shrinkage	2 K (1:1 wght%)	Black	Low	Medium @ Low temperature		1,1-1,2		12 months @ 25°C	Low

Die-Attach-Klebstoffe

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