Die Attach lijmen
Binnen het assortiment elektrische en isolerende lijmen van ROARTIS® hebben verschillende producten een reologie die is geoptimaliseerd voor die-attach-toepassingen. Onze elektrisch geleidende en isolerende lijmen zijn geoptimaliseerd voor doseren of spuiten op hoge snelheid.
Compare | Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | CTE | Tg | Shore Hardness | Thermal conductivity | Work life | Storage | Fineness (µm) | Density (gr/cc) | Thyxotropie | Datasheet |
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https://www.iq-bond.com/products/iq-bond-8429-green-uv/ compare |
IQ-BOND 8429-BLUE UV | Dielectric Ink | UV Acrylate / Bridging coating in printed electronics (RFID antenna’s) | Green | 30.000 mPa.s | 12 months | |||||||||||
https://www.iq-bond.com/products/iq-bond-8429-blue-uv/ compare |
IQ-BOND 8429-BLUE UV | Dielectric Ink | UV Acrylate / Bridging coating in printed electronics (RFID antenna’s) | Blue | 28.000 mPa.s | 12 months | |||||||||||
https://www.iq-bond.com/products/iq-inq-1202/ compare |
IQ-INQ 1202 | Electrically Conductive Ink | Standard for Screen printing, Economical | Gray | 21.000 mPa.s | 15 min @ 120°C | 12 months | ||||||||||
https://www.iq-bond.com/products/iq-inq-1201/ compare |
IQ-INQ 1201 | Electrically Conductive Ink | Standard for Screen printing, Economical | Light Brown | 20.000 mPa.s | 15 min @ 120°C | 12 months | ||||||||||
https://www.iq-bond.com/products/iq-inq-1100/ compare |
IQ-INQ 1100 | Electrically Conductive Ink | Standard for Screen printing | Black | 36.000 mPa.s | 15 min @ 120°C | 12 months | ||||||||||
https://www.iq-bond.com/products/iq-inq-1002/ compare |
IQ-INQ 1002 | Electrically Conductive Ink | Excellent Elongation | Silver | 15.000 mPa.s | 15 min @ 120°C | 12 months | ||||||||||
https://www.iq-bond.com/products/iq-inq-1000/ compare |
IQ-INQ 1000 | Electrically Conductive Ink | Standard for Screen printing, Economical | Silver | 15.000 mPa.s | 15 min @ 120°C | 12 months | ||||||||||
https://www.iq-bond.com/products/iq-sinter-5461/ compare |
IQ-SINTER 5461 | Sinter paste | High thermally & electrically conductive (> 200 W/m.K , 5 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering | Silver | 160.000 mPa.s | Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C | 12 hrs | ||||||||||
https://www.iq-bond.com/products/iq-sinter-5460/ compare |
IQ-SINTER 5460 | Sinter paste | High thermally & electrically conductive (> 200 W/m.K , 4 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering | Silver | 53.000 mPa.s | Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C | 24 hrs | ||||||||||
https://www.iq-bond.com/products/iq-bond-5451-hsce/ compare |
IQ-BOND 5451-HSCE | Hybrid sinter paste | High speed, fine dot dispensing Higher viscosity & improved electrically conductivity version of IQ-BOND 5450-HSCE (> 60 W/m.K , 3,8 x 10-6 Ohm.cm) | Silver | 45.000 mPa.s | Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C | 12 hrs | ||||||||||
https://www.iq-bond.com/products/iq-bond-5450-hsce/ compare |
IQ-BOND 5450-HSCE | Hybrid sinter paste | High speed, fine dot dispensing High thermally & electrically conductivity (> 60 W/m.K , 9 x 10-6 Ohm.cm) | Silver | 20.000 mPa.s | Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C | 12 hrs | ||||||||||
https://www.iq-bond.com/products/iq-bond-2722/ compare |
IQ-BOND 2722 | Insulating | Fast cure, dispensing or jetting processes, Low temperature die attach for flex substrates | Bright Yellow | 100.000 mPa.s | 60 min @ 80°C | 5 days | ||||||||||
https://www.iq-bond.com/products/iq-bond-2705/ compare |
IQ-BOND 2705 | Insulating | Fast cure, dispensing or jetting processes, thermode or conveyor belt oven, fastest version based on hybrid epoxy chemistry | Beige | 35.000 mPa.s | 1 min @ 150°C / 5 sec @ 170°C | 2 days | ||||||||||
https://www.iq-bond.com/products/iq-bond-2700/ compare |
IQ-BOND 2700 | Insulating | Fast cure, dispensing or jetting processes, thermode or conveyor belt oven | Milky/clear | 10.000 mPa.s | 5 min @ 120°C / 10 sec @ 170°C | 5 days |
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https://www.iq-bond.com/products/iq-bond-2580/ compare |
IQ-BOND 2580 | High Temperature Resistant | High tg, dam adhesive, high reliability | 1K | Black | High | High | 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-2650-t-fl/ compare |
IQ-BOND 2650-T-FL | Thermally conductive gapfiller | High Viscosity, non sagging, fast cure, flexible | 2K | Light Red | High | 12 months @ RT |
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https://www.iq-bond.com/products/iq-coat-6000/ compare |
IQ-COAT 6000 | High temperature resistant | Solvent based, high temperature resistant coating for industrial and electronic applications | 1 K | Transparant | Low | 12 months @ RT |
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https://www.iq-bond.com/products/iq-bond-2487/ compare |
IQ-BOND 2487 | High temperature resistant | Insulating Adhesive for component and chip attachment, designed for high temperature applications One Component, Dielectric, Thixotropic Adhesive | 1 K | Milky - Beige | 18.000 mPa.s | Multiple stage cure: 2hrs @ 90°C + 3hrs @ 150°C | 230° C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-5481-ce/ compare |
IQ-BOND 5481-CE | Electrically conductive adhesive (Isotropic) | For high temperature applications | 1 K | Silver | 15.000 mPa.s | Multiple stage cure: 2 hrs @ 90°C + 3 hrs @ 150°C | 230°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-2481/ compare |
IQ-BOND 2481 | Underfill encapsulants | high reliability, thermal cycling from -65°C up to 200°C possible | 1 K | Black | Medium | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2178/ compare |
IQ-BOND 2178 | Underfill encapsulants | resists temperatures over 200°C | 1 K | Milky - Beige | Medium | 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2520/ compare |
IQ-BOND 2520 | Glob Top encapsulant | High Tg (~250°C), for high reliability, high temperature applications | 1 K | Black | High | 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-2647-t-fl/ compare |
IQ-BOND 2647-T-FL | Thermally Conductive | solvent-free, two-component, thermally conductive, epoxy based adhesive, developed for “low stress applications” | 2 K (1:1 wght%) | Dark orange / Red | High | Medium @ Low temperature | 0.8 | Low |
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https://www.iq-bond.com/products/iq-bond-2649-t-fl/ compare |
IQ-BOND 2649-T-FL | Thermally conductive | High viscosity, Non-Sagging, Very Flexible, 2-komponent | 2 K (1:1 wght%) | Dark orange / Red | Very High | Medium @ Low temperature | 1.3 | 12 months @ RT | High |
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https://www.iq-bond.com/products/iq-bond-2648-t-fl/ compare |
IQ-BOND 2648-T-FL | Thermally conductive | very flexible, solvent-free, two-component, thermally conductive, epoxy based adhesive and/or gapfiller, developed for “low stress applications” | 2 K | Dark orange / Red | Medium | Medium @ Low temperature | 1.1 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-8424-uv/ compare |
IQ-BOND 8424 UV | UV-Acrylate | UV-curable, flexibilized, one component, acrylic-based adhesive or coating for optical applications | 1 K | Clear | Low | Fast @ Low Temperature | 12 months @ 5-8°C | Low |
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https://www.iq-bond.com/products/iq-bond-7292-uv/ compare |
IQ-BOND 7292 UV | UV-Acrylate, Glob Top | One component, medium viscosity, medium thixotropy, epoxy-based, UV-curable GLOB-TOP adhesive | 1 K | White | Medium | ~30 seconds at 120 mW/cm² for a 500 μm thick layer (UV-A) | 4 months @ 5°C; >6 months @ -20°C | Medium |
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https://www.iq-bond.com/products/iq-3d-model-5010-uv/ compare |
IQ-3D MODEL 5010 UV | 3D printing | UV-curable, metacrylic-based resin for 3D printing of dental models | 1 K | Yellow - Beige |
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https://www.iq-bond.com/products/iq-cast-9647-fl/ compare |
IQ-CAST 9647-FL | Potting resin | Flexible, room-temperature curable, variation in mix-ratio obtains variation in flexibility and hardness | 2 K (mix-ratio 1:1 of 2:1) | Black | Low | 12 months @ RT | Medium @ Low temperature |
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https://www.iq-bond.com/products/iq-grease-9303/ compare |
IQ-GREASE 9303 | Thermal greases | lower cost, more readily available, general use version of IQ-GREASE 9302 | 1 K | White | Very High | Not applicable | 2,8 | 12 months @ RT |
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https://www.iq-bond.com/products/iq-grease-9302/ compare |
IQ-GREASE 9302 | Thermal greases | high viscosity, non-sagging, thermal interface material, typical application: dissipation of heat from bolted heatsinks onto microprocessors | 1 K | White | Very High | Not applicable | 3,1 | 12 months @ RT |
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https://www.iq-bond.com/products/iq-cleaner-9500/ compare |
IQ-CLEANER 9500 | Cleaning Agents | Safe, non-toxic, water-soluble cleaning agent | Clear | Very Low | Not applicable | Low |
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https://www.iq-bond.com/products/iq-cast-9850-t-ab/ compare |
IQ-CAST 9850-T-AB | Thermally Conductive | Thermal shock resistant, low CTE, room temperature curable, electrically insulating, thermally conductive | 2 K (mix-ratio 100:3,5) | Black | High | Medium @ Low temperature | 1,3 | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-bond-9641-ab/ compare |
IQ-BOND 9641-AB | Potting resin | High ionic purity, biomedical applications, qualifyable to BS6920 for drinking water applications | 2 K (mix-ratio 100:35) | Beige | Low | Medium @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9640/ compare |
IQ-CAST 9640 | Potting resin | Low viscosity, biomedical applications, qualifyable to BS6920 for drinking water applications | 2 K (mix-ratio 100:50) | Beige | Low | Medium @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9460-fr-black/ compare |
IQ-CAST 9460-FR-BLACK | Potting resin | Flame retardant UL49-VO certified potting resin | 2 K (2:1 wght%) | Black | Low | Medium @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9460-fr/ compare |
IQ-CAST 9460-FR | Potting resin | Room temperature curable, flame retardant, very well suited for high temperature applications (140°C-150°C) | 2 K (2:1 wght%) | White | Low | Medium @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9400-ab/ compare |
IQ-CAST 9400-AB | Potting resin | Room temperature curable, unfilled, very well suited for high temperature applications (140°C-150°C) | 2 K (mix-ratio 100:18) | Clear | Low | Medium @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9120-ab/ compare |
IQ-CAST 9120-AB | Potting resin | Low viscosity, very well suited for high temperature applications (140°C-175°C) or extremely low temperatures (-200°C) | 2 K (mix-ratio 100:58) | Clear | Very Low | Medium @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9100-ab/ compare |
IQ-CAST 9100-AB | Potting resin | Very good water resistant, toughness and adhesion, meets FDA regulations permitting use in indirect food contact applications | 2 K (mix-ratio 100:15) | Clear | Low | Medium @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-cast-9044-t-ab/ compare |
IQ-CAST 9044-T-AB | Thermally conductive | High thermally conductive, Room temperature cure | 2 K (1:1 wght%) | Black | High | Medium @ Low temperature | 1,8 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-cast-9025-t-ab/ compare |
IQ-CAST 9025-T-AB | Thermally Conductive | Economic, thermally conductive adhesive, for applications which require heat dissipation | 2 K (1:1 wght%) | Black | Low | Medium @ Low temperature | 1,1 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-cast-9024-t-ab/ compare |
IQ-CAST 9024-T-AB | Thermally Conductive | Encapsulation of electronic and/or industrial components which require heat dissipation, very well suited for high temperature applications, requiring continuous protection up to 150°C | 2 K (1:1 wght%) | Black | Low | Medium @ Low temperature | 1,1 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-8464-uv/ compare |
IQ-BOND 8464-UV | UV-Acrylate | 1 K | Clear | Very Low | Fast @ Low temperature | 12 months @ RT | Low |
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https://www.iq-bond.com/products/iq-bond-8470-uv/ compare |
IQ-BOND 8470-UV | UV-Acrylate | Glob top shape is required, humidity resistant | 1 K | Clear | Low | Fast @ Low temperature | 12 months @ 5-8°C | Medium |
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https://www.iq-bond.com/products/iq-bond-8462m-uv/ compare |
IQ-BOND 8462M-UV | UV-Acrylate | Optimized version of IQ-BOND-8462-UV for cure at 405 mm | 1 K | Clear | Very Low | Fast @ Low temperature | 12 months @ 5-8°C | Low |
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https://www.iq-bond.com/products/iq-bond-8462-uv/ compare |
IQ-BOND 8462-UV | UV-Acrylate | High adhesion strength, hardness, humidity resistant, optical transparency, flexibility, CTE mismatch substrates bondline | 1 K | Clear | Very Low | Fast @ Low temperature | 12 months @ 5-8°C | Low |
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https://www.iq-bond.com/products/iq-bond-8422-uv/ compare |
IQ-BOND 8422-UV | UV-Acrylate | High adhesion, high hardness, non yellowing, good humidity resistance, medium shore hardness | 1 K | Clear | Very Low | Fast @ Low temperature | 12 months @ 5°C-25°C | Low |
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https://www.iq-bond.com/products/iq-bond-8416-uv/ compare |
IQ-BOND 8416-UV | UV-Acrylate | High adhesion strength, hardness, humidity resistant, UV-curable | 1 K | Clear | Very Low | Fast @ Low temperature | 12 months @ 5-8°C | Low |
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https://www.iq-bond.com/products/iq-bond-5973-ace/ compare |
IQ-BOND 5973-ACE | Electrically conductive adhesive (Anisotropic) | SNAP-cure, long work life | 1 K | Brown | Low | Fast @ High temperature | 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5970-ace/ compare |
IQ-BOND 5970-ACE | Electrically conductive adhesive (Anisotropic) | Fast-cure, heat-curing adhesive for Flip Chip Attach, thermode-curing process, high curing speeds | 1 K | Brown | Low | Fast @ High temperature | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5601-ce/ compare |
IQ-BOND 5601-CE | Electrically conductive adhesive (Isotropic) | Low curing temperatures, easy mix ratio, good conductivity even cured at RT, long shelf life | 2 K (1:1 wght%) | Silver | Medium | Medium @ Low temperature | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-5600-ce-smp/ compare |
IQ-BOND 5600-CE-SMP | Electrically conductive adhesive (Isotropic) | Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards), smaller and more uniform particle size version of IQ-BOND 5600-CE | 2 K (100:2,5 wght%) | Silver | High | Medium @ Low temperature | 6 months @ RT | High |
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https://www.iq-bond.com/products/iq-bond-5600-ce/ compare |
IQ-BOND 5600-CE | Electrically conductive adhesive (Isotropic) | Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards) | 2 K (mix-ratio 100:2,5) | Silver | High | Medium @ Low temperature | 6 months @ RT | High |
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https://www.iq-bond.com/products/iq-bond-5409-ce/ compare |
IQ-BOND 5409-CE | Electrically conductive adhesive (Isotropic) | Modified version IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finisches such as Sn, SnPb, OSP-Cu, etc. | 1 K | Silver | Very High | Fast @ High temperature | 3 months @ -20°C; 6 months @ -40°C | TBD |
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https://www.iq-bond.com/products/iq-bond-5408-ce/ compare |
IQ-BOND 5408-CE | Electrically conductive adhesive (Isotropic) | Modified version of IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finishes such as Sn, SnPb, OSP-Cu etc. | 1 K | Silver | Very High | Fast @ High temperature | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-5404-hv-ce/ compare |
IQ-BOND 5404-HV-CE | Electrically conductive adhesive (Isotropic) | Dispensing and jetting through very fine needles, low temperature, higher viscosity version of IQ-BOND 5404-CE | 1 K | Silver | 140.000 mPa.s | 60 min @ 150°C / 120 min @ 120°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-5404-ce/ compare |
IQ-BOND 5404-CE | Electrically conductive adhesive (Isotropic) | Dispensing and jetting through very fine needles, low temperature | 1 K | Silver | 35.000 mPa.s | 60 min @ 150°C / 120 min @ 120°C | 48 hrs | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5402-ce/ compare |
IQ-BOND 5402-CE | Electrically conductive adhesive (Isotropic) | Short curing cycles, good electrical conductivity, high speed small dot dispensing, lower viscosity version of IQ-BOND 5402-CE | 1 K | Silver | 78.000 mPa.s | 5 min @ 150°C / 15 min @ 120°C | 24 hrs | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-5401-ce/ compare |
IQ-BOND 5401-CE | Electrically conductive adhesive (Isotropic) | Short curing cycles, good electrical conductivity, high speed small dot dispensing | 1 K | Silver | Very High | Fast @ High temperature | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-5132-ce/ compare |
IQ-BOND 5132-CE | Electrically conductive adhesive (Isotropic) | Flexible, dispensing/printing/stamping, electrically conductive version of IQ-BOND 2132 | 1 K | Silver | 15.000 mPa.s | 15 min @ 175°C / 90 min @ 120°C | 12 hrs | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-3401/ compare |
IQ-BOND 3401 | SMD-adhesive | High speed dispensing/jetting applications, high reactivity versus low exotherm, long worklife | 1 K | Red | High | Fast @ High temperature | 6 months @ 8°C | High |
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https://www.iq-bond.com/products/iq-bond-3400/ compare |
IQ-BOND 3400 | SMD-adhesives | Stencil/screen printing applications, resists temperatures over 200°C for short periods of time, long potlife | 1 K | Red | Very High | Fast @ High temperature | 0,3 | 6 months @ 8°C | High |
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https://www.iq-bond.com/products/iq-bond-3202/ compare |
IQ-BOND 3202 | SMD-adhesives | High speed stencil and/or screen printing applications, low temperature | 1 K | Red | Very High | Fast @ High temperature; Medium @ Medium temperature | 4 months @ 5°C; 6 months @ -20°C | High |
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https://www.iq-bond.com/products/iq-bond-3200/ compare |
IQ-BOND 3200 | SMD-adhesive | Stencil printing applications, dispensing-high jetting processes, fast cure at low temperature | 1 K | Red | High | Fast @ High temperature; Medium @ Medium temperature | 4 months @ 5°C; 6 months @ -20°C | High |
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https://www.iq-bond.com/products/iq-bond-2801-t/ compare |
IQ-BOND 2801-T | Thermally conductive | Non-flow/non-sagging, higher viscosity/higher thyxo version of IQ-BOND 2800-T | 1 K | White | Very High | Other | 1,2 | 1 month - 5°C; 6 months - -20°C; 12 months - -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2800-t/ compare |
IQ-BOND 2800-T | Thermally conductive | Optimized for dispensing, long potlife, fine filler for thin bondline | 1 K | White | High | Other | 1 | 1 month - 5°C; 6 months - -20°C; 12 months - -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2640-wh-mfc-ab/ compare |
IQ-BOND 2640-WH-MFC-AB | Structural adhesive | White version of IQ-BOND 2640-FC | 2 K (1:1 wght%) | White | Medium | Fast @ Low temperature | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2640-fc-black/ compare |
IQ-BOND 2640-FC-Black | Structural adhesive | Black version of the IQ-BOND 2640-FC | 2 K (1:1 wght%) | Black | Medium | Fast @ Low temperature | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2640-fc/ compare |
IQ-BOND 2640-FC | Structural adhesive | Fast, room temperature curable adhesive, good adhesion strenght | 2 K (1:1 wght%) | Yellow | Medium | Fast @ Low temperature | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2612-t-fc/ compare |
IQ-BOND 2612-T-FC | Thermally Conductive | Fast cure, thermo-couple bonding, faster version of IQ-BOND 2611-T-FC | 2 K (1:1 wght%) | White | Medium | Fast @ Low temperature | 1,3 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2611-t-fc/ compare |
IQ-BOND 2611-T-FC | Thermally conductive | Fast cure, thermo-couple bonding | 2 K (1:1 wght%) | White | Medium | Fast @ Low temperature | 1,2 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2610-t-ab/ compare |
IQ-BOND 2610-T-AB | Thermally Conductive | Room-temperature curable, non-sagging, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C) | 2 K (mix-ratio 100:39) | Black | Very High | Fast @ Low Temperature | 1,3 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2609-t-ab/ compare |
IQ-BOND 2609-T-AB | Thermally Conductive | Very fast curable, non-sagging, high viscosity, reliable over a large range of temperatures, very well suited high temperature application (up to 150°C) | 2 K (4:1 wght%) | Black | Very High | Fast @ Low temperature | 0,9 | 12 months @ RT | Medium |
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https://www.iq-bond.com/products/iq-bond-2538/ compare |
IQ-BOND 2538 | Glob Top encapsulant | Dispensing, printing, stamping processes, high adhesion strength, allows temperatures between - 50°C and +200°C | 1 K | Black | Very High | Other | 0,5 | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2517/ compare |
IQ-BOND 2517 | Glob Top Encapsulant | Non-Bleeding, exceptional reliability performance in harsh environment, dispense applications | 1 K | Black | Medium | Other | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2516/ compare |
IQ-BOND 2516 | Glob Top Encapsulant | Small particles, high filler loading with thyxotropic behavior during dispensing process, curing cycling requirements from -65°C up to +160°C | 1 K | Black | Medium | Other | 3 months @ -20°C; 6 months @ -40°C |
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https://www.iq-bond.com/products/iq-bond-2515/ compare |
IQ-BOND 2515 | Glob Top Encapsulant | Lower shrinkage, higher filler loading version of IQ-BOND 2514 | 1 K | Black | Medium | 60 min @ 165°C | 3 months @ -20°C; 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2514/ compare |
IQ-BOND 2514 | Glob Top encapsulant | Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 and 2513, optimized for applications where flow is required | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2513/ compare |
IQ-BOND 2513 | Glob Top Encapsulant | Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2512/ compare |
IQ-BOND 2512 | Glob Top Encapsulant | Thermal cycling requirements from -65°C up to +160°C, dispensable, use in combination with IQ-BOND 2504 possible | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2505/ compare |
IQ-BOND 2505 | Glob Top Encapsulant | Slightly less thyxotropic version of IQ-BOND 2504 | 1 K | Black | TBD | Other | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2504/ compare |
IQ-BOND 2504 | Glob Top Encapsulant | Non-flow/non-sagging, dispensable, suitable for thermal cycling requirements from -65°C up to + 160°C | 1 K | Black | Very High | Other | 3 months @ -20°C; 6 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2476/ compare |
IQ-BOND 2476 | Underfill encapsulants | Low CTE, NASA certified (meets NASA outgassing standards), high glass transition temperature combined with low thermal expansion | 1 K | White | Medium | Medium @ High Temperature | 6 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2473-lv/ compare |
IQ-BOND 2473-LV | Underfill encapsulants | Low Viscosity | 1 K | Black | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2473/ compare |
IQ-BOND 2473 | Underfill encapsulants | Low viscosity | 1 K | White | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2472-lv/ compare |
IQ-BOND 2472-LV | Underfill encapsulants | Lower viscosity version of IQ-BOND 2472, for improved flow | 1 K | White | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2472/ compare |
IQ-BOND 2472 | Underfill encapsulants | Low viscosity | 1 K | White | Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2432-lv-t/ compare |
IQ-BOND 2432-LV-T | Thermally conductive | Flexible dielectric, thermally conductive, non-abrasive filler, high adhesion strength, lower viscous version of IQ-BOND 2432- | 1 K | White | Medium | Other | 0,9 | 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-24-32-t/ compare |
IQ-BOND 2432-T | Thermally Conductive | Dispensing, printing, stamping processes, high adhesion strength, based on very fine non-abrasive filler technology | 1 K | White | 50.000 mPa.s | 15 min @ 175°C / 60 min @ 150°C / 90 min @ 120°C | 0,9 | 12 hrs | 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2409-lv/ compare |
IQ-BOND 2409-LV | Underfill encapsulants | Lower viscosity version of IQ-BOND 2409 for improved flow | 1 K | Black | Low | Fast @ High temperature | 5 months @ < 5°C; 12 months @ -20 | Low |
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https://www.iq-bond.com/products/iq-bond-2409/ compare |
IQ-BOND 2409 | Underfill encapsulants | Low viscous, fast cure underfill adhesive, very long potlife | 1 K | Black | Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-2408/ compare |
IQ-BOND 2408 | structural adhesive | Medium viscous, fast cure adhesive, resist temperature over 200°C for short periods of time | 1 K | Brown | Medium | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2402-black/ compare |
IQ-BOND 2402-Black | SMD-adhesives | Black version of the IQ-BOND 2400 | 1 K | Black | Very High | Fast @ High temperature | 6 months @ 8°C | High |
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https://www.iq-bond.com/products/iq-bond-2401/ compare |
IQ-BOND 2401 | SMD-adhesives | High speed dispensing; good green strength, low exotherm | 1 K | Yellow | High | Fast @ High temperature | 6 months @ 8°C | High |
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https://www.iq-bond.com/products/iq-bond-2400/ compare |
IQ-BOND 2400 | SMD-adhesives | Stencil printing applications, good green strength, resists temperatures over 200°C for shorts periods of time | 1 K | Yellow | Very High | Fast @ High temperature | 6 months @ 8°C | High |
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https://www.iq-bond.com/products/iq-bond-2280/ compare |
IQ-BOND 2280 | Glob Top Encapsulant | 80°C cure, needles for dispinsing of >400µm | 1 K | Black | Medium | Fast @ High temperature; Medium @ Medium temperature | 6 months @ <5°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2243-fr-mt/ compare |
IQ-BOND 2243-FR-MT | Flame retardant materials | Low temperature cure adhesive, medium-thyxo, good green strength | 1 K | Black | Very High | Fast @ High temperature; Medium @ Medium temperature | 6 months @ <5°C; 12 months @ -20°C | High |
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https://www.iq-bond.com/products/iq-bond-2242-fr-ht/ compare |
IQ-BOND 2242-FR-HT | Flame retardant materials | low temperature cure adhesive, high-thyxo, good green strength | 1 K | Black | Very High | 30 min @ 80°C | 6 months @ <5°C; 12 months @ -20°C | High |
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https://www.iq-bond.com/products/iq-bond-2238-t/ compare |
IQ-BOND 2238-T | Thermally conductive | Low temperature cure adhesive, long potlife, very fast curing cycles, medium viscosity | 1 K | White | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,7 - 0,8 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2236-t/ compare |
IQ-BOND 2236-T | Thermally conductive | Low temperature adhesive, long potlife, very fast curing cycles | 1 K | White | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,6-0,7 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2235-t/ compare |
IQ-BOND 2235-T | Thermally conductive | Non-sagging-adhesive | 1 K | White | Very High | Fast @ High temperature; Medium @ Medium temperature | 1,1 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | High |
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https://www.iq-bond.com/products/iq-bond-2234-t/ compare |
IQ-BOND 2234-T | Thermally conductive | Optimized for small dot dispensing, very fast curing cycles | 1 K | Milky | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,9 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2232-t/ compare |
IQ- BOND 2232-T | Thermally conductive | Optimized for small dot dispensing, very fast curing cycles | 1 K | White | Medium | Fast @ High temperature; Medium @ Medium temperature | 0,9 | 2 months @ <5°C; 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-2231-t/ compare |
IQ-BOND 2132-T | Thermally conductive | Economic, thermally conductive adhesive with a long potlife | 1 K | White | Low | Fast @ High temperature; Medium @ Medium temperature | 0,6-0,7 | 2 months - 5°C; 6 months - -20°C; 12 months - -40° | Medium |
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https://www.iq-bond.com/products/iq-bond-2203/ compare |
IQ-BOND 2203 | SMD-adhesives | Higher viscosity SMD adhesive for stencil printing; Yellow version of IQ-BOND 3203 | 1 K | Yellow | Very High | Fast @ High temperature; Medium @ Medium temperature | 6 months @ <5°C; 12 months @ -20°C | High |
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https://www.iq-bond.com/products/iq-bond-2202/ compare |
IQ-BOND 2202 | SMD-adhesives | Higher viscosity version of IQ-BOND 2200 | 1 K | Yellow | Very High | Fast @ High temperature; Medium @ Medium temperature | 4 months @ 5°C | High |
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https://www.iq-bond.com/products/iq-bond-2201/ compare |
IQ-BOND 2201 | SMD-adhesives | Lower viscosity version of IQ-BOND 2200 | 1 K | Yellow | High | Fast @ High temperature; Medium @ Medium temperature | 6 months @ <5°C; 12 months @ -20°C | High |
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https://www.iq-bond.com/products/iq-bond-2200/ compare |
IQ-BOND 2200 | SMD-adhesive | 80°c-cure; bonding on PET/PEN | 1 K | Yellow | High | Fast @ High temperature; Medium @ Medium temperature | 6 months @ <5°C; 12 months @ -20°C | High |
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https://www.iq-bond.com/products/iq-bond-2177/ compare |
IQ-BOND 2177 | Underfill encapsulants | Thermally conductive underfill, thermal conductivity: 0,8-0,9 W/m.K) | 1 K | White | Low | Other | 12 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2176/ compare |
IQ-BOND 2176 | Underfill encapsulants | High Tg; low viscosity underfill for high temperature applications | 1 K | White | Low | Other | 12 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2175/ compare |
IQ-BOND 2175 | Underfill encapsulants | Very low viscosity, for very small bondlines < 5 µm | 1 K | Clear | low | Fast @ Low temperature | 12 months @ -40°C | Low |
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https://www.iq-bond.com/products/iq-bond-2132/ compare |
IQ-BOND 2132 | Structural adhesive | Flexible; low stress; dielectric adhesive; High temperature resistance | 1 K | Yellow | Medium | Medium @ High temperature | 6 months @ -20°C; 12 months @ -40°C | Medium |
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https://www.iq-bond.com/products/iq-bond-1402-whlv/ compare |
IQ-BOND 1402-WHLV | Underfill encapsulants | White reflective underfill; fast cure | 1 K | White | low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
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https://www.iq-bond.com/products/iq-bond-1632-t/ compare |
IQ-BOND 1632-T | Thermally conductive | Easy mix-ratio 1:1; flexible for CTE mismatch; high temperature resistance (200°C) | 2 K (1:1 wght%) | grey | High | Medium @ High temperature | 1,1-1,2 | 12 months @ 25°C | Medium |
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https://www.iq-bond.com/products/wcx/ compare |
IQ- BOND 1501-T | Thermally conductive | Alumina-filled, economic, long potlife (>1 week) | 1 K | White | Medium | Medium @ Medium temperature | 0.8-0.9 | 1 month - 5°C; 6 months - -20°C; 12 months - -40°C | Medium |
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https://www.iq-bond.com/products/cx/ compare |
IQ-BOND 1625-T | Thermally conductive | Easy mix ratio 1:1, low shrinkage | 2 K (1:1 wght%) | Black | Low | Medium @ Low temperature | 1,1-1,2 | 12 months @ 25°C | Low |
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