It was nice meeting you

In the first two weeks of October 2022, Roartis IQ-BOND participated during the IMAPS conference and exhibition in Boston, USA related to microelectronics packaging, as well as the TechBlick show, in Eindhoven, Netherlands focusing on the topics of printed, flexible, hybrid, wearable, 3D & structural electronics.

Both shows have been quite a success for our fast growing company and have brought many new opportunities for our existing portfolio, as well as insights on future material requirements.

As we’ve been expanding our IQ-BOND and IQ-CAST product portfolio extensively over the past few years and months, targeting high temperature and high power semiconductor packaging, as well as lower temperature compatible materials for printed electronic applications, we’ve seen great interest in our products and offerings.

We look forward working with the many companies that have reached out to us, to discuss their applications.

October 19th, 2022, Genk, Belgium