Underfill

Underfills zijn meestal op epoxy gebaseerde materialen die worden gebruikt in elektronische assemblages om de opening tussen de BGA-, CSP- of flip-chip componenten en de printplaat op te vullen. Op die manier worden de componenten beter beschermd tegen schokken, vallen, thermische-cycli en trillingsimpact.

Roartis^® biedt een reeks van capillaire underfills met unieke kenmerken aan, zoals hoge Tg, lage CTE en goede vloei-eigenschappen (voor toepassingen met zeer kleine openingen).

1 of 2 Components

Viscosity

Thyxotropie

Cure

Color

Product	Product group	Strong points	One komponent or two komponents	Color	Viscosity	Cure	Storage	Thyxotropie
IQ-BOND 2481	Underfill encapsulants	high reliability, thermal cycling from -65°C up to 200°C possible	1 K	Black	Medium		3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2178	Underfill encapsulants	resists temperatures over 200°C	1 K	Milky - Beige	Medium		6 months @ -40°C	Low
IQ-BOND 2476	Underfill encapsulants	Low CTE, NASA certified (meets NASA outgassing standards), high glass transition temperature combined with low thermal expansion	1 K	White	Medium	Medium @ High Temperature	6 months @ -40°C	Low
IQ-BOND 2473-LV	Underfill encapsulants	Low Viscosity	1 K	Black	Very Low	Fast @ High temperature	4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2473	Underfill encapsulants	Low viscosity	1 K	White	Very Low	Fast @ High temperature	4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2472-LV	Underfill encapsulants	Lower viscosity version of IQ-BOND 2472, for improved flow	1 K	White	Very Low	Fast @ High temperature	4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2472	Underfill encapsulants	Low viscosity	1 K	White	Low	Fast @ High temperature	4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2409-LV	Underfill encapsulants	Lower viscosity version of IQ-BOND 2409 for improved flow	1 K	Black	Low	Fast @ High temperature	5 months @ < 5°C; 12 months @ -20	Low
IQ-BOND 2409	Underfill encapsulants	Low viscous, fast cure underfill adhesive, very long potlife	1 K	Black	Low	Fast @ High temperature	4 months @ 5°C; 12 months @ -20°C	Low
IQ-BOND 2177	Underfill encapsulants	Thermally conductive underfill, thermal conductivity: 0,8-0,9 W/m.K)	1 K	White	Low	Other	12 months @ -40°C	Low
IQ-BOND 2176	Underfill encapsulants	High Tg; low viscosity underfill for high temperature applications	1 K	White	Low	Other	12 months @ -40°C	Low
IQ-BOND 2175	Underfill encapsulants	Very low viscosity, for very small bondlines < 5 µm	1 K	Clear	low	Fast @ Low temperature	12 months @ -40°C	Low
IQ-BOND 1402-WHLV	Underfill encapsulants	White reflective underfill; fast cure	1 K	White	low	Fast @ High temperature	4 months @ 5°C; 12 months @ -20°C	Low

Underfill

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