“Glob top” – “Dam & Fill” harsen

In veel elektronische assemblages vereisen gevoelige componenten, zoals Si-chips, kristaloscillatoren, RF componenten, BGA’s en CSP’s betrouwbare bescherming tegen agressieve omgevingen.

Roartis^® epoxy gebaseerde “glop top” en “dam & fill” harsen met hoge Tg en lage CTE worden gebruikt in veeleisende toepassingen waar klanten een thermische weerstand tussen -55°C tot 180°C vereisen. Ook uitgebreide vochttesten (2000hrs 85°C/85%RH) zijn geen obstakel gebleken voor Roartis^® “glob top” en “dam & fill” materialen.

Waar “dam & fill” inkapselingsmiddelen meestal gebruikt worden voor grotere chipapplicaties, worden “glob tops” meestal gebruikt voor kleinere chips. Om de procestijd te minimaliseren, is de chemie van de “dam & fill” inkapselingsproducten geoptimaliseerd om een co-uithardingsproces mogelijk te maken.

Product	Product group	Strong points	One komponent or two komponents	Color	Viscosity	Cure	Thermal conductivity	Storage	Thyxotropie
IQ-BOND 2520	Glob Top encapsulant	High Tg (~250°C), for high reliability, high temperature applications	1 K	Black	High			6 months @ -40°C
IQ-BOND 7292 UV	UV-Acrylate, Glob Top	One component, medium viscosity, medium thixotropy, epoxy-based, UV-curable GLOB-TOP adhesive	1 K	White	Medium	~30 seconds at 120 mW/cm² for a 500 μm thick layer (UV-A)		4 months @ 5°C; >6 months @ -20°C	Medium
IQ-BOND 2538	Glob Top encapsulant	Dispensing, printing, stamping processes, high adhesion strength, allows temperatures between - 50°C and +200°C	1 K	Black	Very High	Other	0,5	6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 2517	Glob Top Encapsulant	Non-Bleeding, exceptional reliability performance in harsh environment, dispense applications	1 K	Black	Medium	Other		3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2516	Glob Top Encapsulant	Small particles, high filler loading with thyxotropic behavior during dispensing process, curing cycling requirements from -65°C up to +160°C	1 K	Black	Medium	Other		3 months @ -20°C; 6 months @ -40°C
IQ-BOND 2515	Glob Top Encapsulant	Lower shrinkage, higher filler loading version of IQ-BOND 2514	1 K	Black	Medium	60 min @ 165°C		3 months @ -20°C; 6 months @ -40°C	Low
IQ-BOND 2514	Glob Top encapsulant	Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 and 2513, optimized for applications where flow is required	1 K	Black	Low	Other		3 months @ -20°C; 6 months @ -40°C	Low
IQ-BOND 2513	Glob Top Encapsulant	Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512	1 K	Black	Low	Other		3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2512	Glob Top Encapsulant	Thermal cycling requirements from -65°C up to +160°C, dispensable, use in combination with IQ-BOND 2504 possible	1 K	Black	Low	Other		3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 2505	Glob Top Encapsulant	Slightly less thyxotropic version of IQ-BOND 2504	1 K	Black	TBD	Other		3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 2504	Glob Top Encapsulant	Non-flow/non-sagging, dispensable, suitable for thermal cycling requirements from -65°C up to + 160°C	1 K	Black	Very High	Other		3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 2280	Glob Top Encapsulant	80°C cure, needles for dispinsing of >400µm	1 K	Black	Medium	Fast @ High temperature; Medium @ Medium temperature		6 months @ <5°C	Medium

“Glob top” – “Dam & Fill” harsen

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