Adhésifs électroconducteurs (ISOTROPES)

Roartis^® propose des adhésifs électroconductives isotropes (conductrice en 3 dimensions) et des adhésifs électroconductives anisotropes (conductrice uniquement dans la direction Z).

Notre gamme des adhésifs électroconducteurs contient des matériaux optimisés pour les méthodes d’applications comme dispense, jetting, sérigraphie, ainsi que pour tamponnage.

Les applications typiques incluent le collage des composants micro-électroniques sur des substrats sensibles à la température, tels que des circuits flexibles, ou le remplacement de pâtes à braser dans les applications où une flexibilité accrue est requise, en particulier pour les exigences de cyclage thermique sévères.

1 of 2 Components

Viscosity

Thyxotropie

Cure

Color

Product	Product group	Strong points	One komponent or two komponents	Color	Viscosity	Cure	Tg	Work life	Storage	Thyxotropie
IQ-BOND 5481-CE	Electrically conductive adhesive (Isotropic)	For high temperature applications	1 K	Silver	15.000 mPa.s	Multiple stage cure: 2 hrs @ 90°C + 3 hrs @ 150°C	230°C	24 hrs	3 months @ -20°C; 6 months @ -40°C
IQ-BOND 5601-CE	Electrically conductive adhesive (Isotropic)	Low curing temperatures, easy mix ratio, good conductivity even cured at RT, long shelf life	2 K (1:1 wght%)	Silver	Medium	Medium @ Low temperature			12 months @ RT	Medium
IQ-BOND 5600-CE-SMP	Electrically conductive adhesive (Isotropic)	Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards), smaller and more uniform particle size version of IQ-BOND 5600-CE	2 K (100:2,5 wght%)	Silver	High	Medium @ Low temperature			6 months @ RT	High
IQ-BOND 5600-CE	Electrically conductive adhesive (Isotropic)	Low curing temperatures, high viscous and thyxotropic, low outgassing (meets ESA and NASA outgassing standards)	2 K (mix-ratio 100:2,5)	Silver	High	Medium @ Low temperature			6 months @ RT	High
IQ-BOND 5409-CE	Electrically conductive adhesive (Isotropic)	Modified version IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finisches such as Sn, SnPb, OSP-Cu, etc.	1 K	Silver	Very High	Fast @ High temperature			3 months @ -20°C; 6 months @ -40°C	TBD
IQ-BOND 5408-CE	Electrically conductive adhesive (Isotropic)	Modified version of IQ-BOND 5402-CE for making it suitable for SMD-component attach with non-noble finishes such as Sn, SnPb, OSP-Cu etc.	1 K	Silver	Very High	Fast @ High temperature			3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 5404-HV-CE	Electrically conductive adhesive (Isotropic)	Dispensing and jetting through very fine needles, low temperature, higher viscosity version of IQ-BOND 5404-CE	1 K	Silver	140.000 mPa.s	60 min @ 150°C / 120 min @ 120°C		24 hrs	3 months @ -20°C; 6 months @ -40°C	High
IQ-BOND 5404-CE	Electrically conductive adhesive (Isotropic)	Dispensing and jetting through very fine needles, low temperature	1 K	Silver	35.000 mPa.s	60 min @ 150°C / 120 min @ 120°C		48 hrs	3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5402-CE	Electrically conductive adhesive (Isotropic)	Short curing cycles, good electrical conductivity, high speed small dot dispensing, lower viscosity version of IQ-BOND 5402-CE	1 K	Silver	78.000 mPa.s	5 min @ 150°C / 15 min @ 120°C		24 hrs	3 months @ -20°C; 6 months @ -40°C	Medium
IQ-BOND 5401-CE	Electrically conductive adhesive (Isotropic)	Short curing cycles, good electrical conductivity, high speed small dot dispensing	1 K	Silver	Very High	Fast @ High temperature			6 months @ -20°C; 12 months @ -40°C	High
IQ-BOND 5132-CE	Electrically conductive adhesive (Isotropic)	Flexible, dispensing/printing/stamping, electrically conductive version of IQ-BOND 2132	1 K	Silver	15.000 mPa.s	15 min @ 175°C / 90 min @ 120°C		12 hrs	6 months @ -20°C; 12 months @ -40°C	High

Adhésifs électroconducteurs (ISOTROPES)

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